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Proceedings Papers

Integrated Heterogeneous Design of Semiconductor Heat Sink via Scaled Direct Micro-Modeling, Upper Scale VAT Simulation and Experiment: Comparison and Verification of Properties

V. S. Travkin, E. D. Sergievsky, E. V. Krinitsky, I. Catton
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 75-80, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24380
https://doi.org/10.1115/IMECE2001/HTD-24380
... performance features and shown insolvency of using heat transfer and effectiveness parameter. A number of data reduction parameters and procedures were developed using scaling heterogeneous formulation by volume averaging theory (VAT). Analysis brought in this work supports the procedures used to connect...
View Paper titled, Integrated Heterogeneous Design of Semiconductor Heat Sink via Scaled Direct Micro-Modeling, Upper Scale VAT Simulation and Experiment: Comparison and Verification of Properties
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Topics: Design, Heat sinks, Modeling, Semiconductors (Materials), Simulation