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Proc. ASME. IMECE2013, Volume 8A: Heat Transfer and Thermal Engineering, V08AT09A034, November 15–21, 2013
Paper No: IMECE2013-63668
... A numerical solution of heat transfer by combined natural convection and surface radiation in a square enclosure with thick adiabatic top and bottom walls and isothermal vertical walls is presented. The present model was used to obtain new results with the addition of thermal conduction...
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1923-1934, November 13–19, 2009
Paper No: IMECE2009-12388
... generation that is applicable to both large and small length scales. The conventional formula for entropy generation in heat diffusion can be derived under the local equilibrium assumption. Furthermore, the phonon brightness temperature is introduced to describe the nature of nonequilibrium heat conduction...
Proc. ASME. IMECE2003, Heat Transfer, Volume 4, 15-19, November 15–21, 2003
Paper No: IMECE2003-41149
...) conduction pumping has potential to actively control the two-phase flow distribution among parallel evaporator lines. In this paper, an EHD conduction pump, designed for active flow control of the parallel evaporators, is experimentally investigated in a single-phase liquid refrigerant loop. specifically...
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 493-500, November 13–19, 2004
Paper No: IMECE2004-59345
... 31 03 2008 Unlike the electrohydrodynamic (EHD) induction and iondrag pumping, the conduction pumping is associated with the heterocharge layers of finite thickness in the vicinity of the electrodes which are based on the process of dissociation of the neutral electrolytic species...
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 171-180, November 13–19, 2004
Paper No: IMECE2004-59628
... 31 03 2008 An extensive 3-D conjugate numerical study is conducted to assess the thermal performance of the novel Power Quad Flat No Lead (PQFN) packages for automotive applications. Several PQFN packages are investigated, ranging from smaller die/flag size to larger ones, single...
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 267-272, November 13–19, 2004
Paper No: IMECE2004-62077
... temperature is slightly cooler than for the open module (<<3°C). This suggests that the die peak temperature measured in an open module can be adjusted (by subtracting 2–3°C) to represent the die temperature in a closed module. CFD free convection RF modules simulation conduction e m nd em...
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 207-212, November 5–10, 2006
Paper No: IMECE2006-14722
... 28 01 2008 An extensive 3-D conjugate numerical study is conducted to assess the thermal performance of the novel 54 lead SOIC (with inverted exposed Cu pad) packages for automotive applications. The thermal performance of the modified designs with exposed pad are investigated, ranging...