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Structural Analysis in Microelectronics and Fiber Optics
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Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 207-217, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0820
https://doi.org/10.1115/IMECE1997-0820
View Paper titled, A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties
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Topics: Epoxy adhesives, Epoxy resins, Fracture toughness, Reliability, Solders, Adhesives, Bonding, Creep, Fatigue, Fracture (Materials)
Proceedings Papers

Low Cost Plastic Packaging of the Network Interface Unit

M. A. Zimmerman
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 65-80, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0815
https://doi.org/10.1115/IMECE1997-0815
View Paper titled, Low Cost Plastic Packaging of the Network Interface Unit
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Topics: Packaging, Electronics, Snap fitting, Design, Fire resistance, Gaskets, Heat, Hinges, Injection molded plastics, Low temperature
Proceedings Papers

Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip

Toshinori Mimura, Sheng Liu, Haruhiko Asada
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 219-225, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0821
https://doi.org/10.1115/IMECE1997-0821
View Paper titled, Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip
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Topics: Printing, Solders, Flow (Dynamics), Printed circuit boards, Temperature, Visualization
Proceedings Papers

Assessment of Chip-Scale Package Design Options

Sue Y. Teng, Yifan Guo, Vijay Sarihan
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 15-20, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0811
https://doi.org/10.1115/IMECE1997-0811
View Paper titled, Assessment of Chip-Scale Package Design Options
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Topics: Design, Manufacturing, Simulation, Density, Equipment performance, Finite element analysis, Flip-chip, Shrinkage (Materials), Thermal stresses
Proceedings Papers

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Cemal Basaran, Rumpa Chandaroy
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 227-242, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0822
https://doi.org/10.1115/IMECE1997-0822
View Paper titled, A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading
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Topics: Dynamic testing (Materials), Reliability, Solder joints, Dynamic analysis, Failure mechanisms, Solders, Constitutive equations, Cycles, Defense industry, Failure
Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0818
https://doi.org/10.1115/IMECE1997-0818
View Paper titled, Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles
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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds
Proceedings Papers

Comparison of Different Solder Systems Based on Propensity for Damage

Vijay Sarihan
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 243-248, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0823
https://doi.org/10.1115/IMECE1997-0823
View Paper titled, Comparison of Different Solder Systems Based on Propensity for Damage
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Topics: Damage, Solders, Stress, Temperature, Cycles, Fatigue, Fatigue life, Finite element methods, Alloys, Eutectic alloys
Proceedings Papers

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 33-54, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0813
https://doi.org/10.1115/IMECE1997-0813
View Paper titled, Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure
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Topics: Epoxy adhesives, Epoxy resins, Glass fibers, Stress, Fibers, Buckling, Delamination, Design, Metals, Optical fiber
Proceedings Papers

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

D. R. Liu
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 249-259, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0824
https://doi.org/10.1115/IMECE1997-0824
View Paper titled, Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs
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Topics: Creep, Fatigue, Fracture (Materials), Fracture (Process), Solder joints, Temperature, Printed circuit boards, Damage, Melting, Separation (Technology)
Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0819
https://doi.org/10.1115/IMECE1997-0819
View Paper titled, Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability
Proceedings Papers

Structural Integrity of Optical Fibers in Connectors

Wilton W. King, Bruce G. LeFevre, A. Guy Hardee
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 261-269, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0825
https://doi.org/10.1115/IMECE1997-0825
View Paper titled, Structural Integrity of Optical Fibers in Connectors
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Topics: Epoxy adhesives, Epoxy resins, Fibers, Finite element analysis, Fracture (Materials), Fracture (Process), Optical fiber, Reliability, Stress analysis (Engineering), Structural analysis
Proceedings Papers

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

Qazi S. Ilyas, Ephraim Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 81-88, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0816
https://doi.org/10.1115/IMECE1997-0816
View Paper titled, “Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures
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Topics: Failure, Electronic packages, Microelectronic devices, Molding, Optical fiber, Structural analysis
Proceedings Papers

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Y. Feng, V. R. Raju, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0817
https://doi.org/10.1115/IMECE1997-0817
View Paper titled, Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs
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Topics: Failure, Adhesion, Fracture mechanics, Manufacturing, Mechanical behavior, Microelectronic devices, Modeling, Molding, Reliability, Surfaces (Materials)
Proceedings Papers

Design Considerations in Avionics Electronic Packaging

Ali Jamnia, Robert E. Walter
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 1-13, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0810
https://doi.org/10.1115/IMECE1997-0810
View Paper titled, Design Considerations in Avionics Electronic Packaging
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Topics: Avionics, Design, Electronic packaging, Aeronautics, Aviation, Electronic packages, Engineers, Failure, Finite element methods, Packaging
Proceedings Papers

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

S. Shakya, S. M. Heinrich, J. Liang, P. S. Lee
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 55-63, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0814
https://doi.org/10.1115/IMECE1997-0814
View Paper titled, Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly
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Topics: Ball-Grid-Array packaging, Ceramics, Computer simulation, Die cutting, Disks, Displacement, Finite element analysis, Finite element methods, Flip-chip packages, Geometry
Proceedings Papers

Manufacturability of Underfill Processing for Low Cost Flip Chip

Daniel F. Baldwin, Nathan W. Pascarella
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 21-31, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0812
https://doi.org/10.1115/IMECE1997-0812
View Paper titled, Manufacturability of Underfill Processing for Low Cost Flip Chip
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Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Compression, Electronics, Manufacturing, Printed circuit boards, Reliability, Semiconductor devices, Surface mount packaging