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Proceedings Papers

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Peng Zhou, Kenneth E. Goodson
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 51-57, November 11–16, 2001
Paper No: IMECE2001/HTD-24377
DOI: https://doi.org/10.1115/IMECE2001/HTD-24377
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Topics: Integrated circuits, Junctions, Modeling, Pressure, Thermal resistance, Electronic packages, Transients (Dynamics), Electronic packaging, Experimental methods, Fillers (Materials)
Proceedings Papers

Effects of an Auxiliary Plate Position on Natural Convection in a Vertical Channel With Radiation

Assunta Andreozzi, Oronzio Manca, Biagio Morrone
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 3-12, November 11–16, 2001
Paper No: IMECE2001/HTD-24372
DOI: https://doi.org/10.1115/IMECE2001/HTD-24372
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Topics: Natural convection, Radiation (Physics), Radiative heat transfer, Wall temperature, Emissivity, Rayleigh number, Computer cooling, Heat flux, Heat transfer, Telecommunications
Proceedings Papers

Prediction of Thermal Contact Conductance by Surface Deformation Analysis

Vishal Singhal, Suresh V. Garimella
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 43-50, November 11–16, 2001
Paper No: IMECE2001/HTD-24376
DOI: https://doi.org/10.1115/IMECE2001/HTD-24376
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Topics: Contact resistance, Electrical conductance, Surface deformation
Proceedings Papers

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien -Yu Tom Lee, Jorge Luis Rosales
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 81-89, November 11–16, 2001
Paper No: IMECE2001/HTD-24381
DOI: https://doi.org/10.1115/IMECE2001/HTD-24381
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Topics: Air jets, Cooling, Microelectronic devices, Heat transfer, Channel flow, Flow (Dynamics), High temperature, Reynolds number, Buckling, Engineering simulation
Proceedings Papers

A Simplified Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology

Ravi S. Prasher, James Shipley, Amit Devpura
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 59-66, November 11–16, 2001
Paper No: IMECE2001/HTD-24378
DOI: https://doi.org/10.1115/IMECE2001/HTD-24378
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Topics: Design, Heat pipes, Modeling, Vapors, Energy dissipation, Heat, Heat conduction, Heat sinks, Heating, Temperature
Proceedings Papers

Integrated Heterogeneous Design of Semiconductor Heat Sink via Scaled Direct Micro-Modeling, Upper Scale VAT Simulation and Experiment: Comparison and Verification of Properties

V. S. Travkin, E. D. Sergievsky, E. V. Krinitsky, I. Catton
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 75-80, November 11–16, 2001
Paper No: IMECE2001/HTD-24380
DOI: https://doi.org/10.1115/IMECE2001/HTD-24380
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Topics: Design, Heat sinks, Modeling, Semiconductors (Materials), Simulation
Proceedings Papers

Instability and Heat Transfer in Mixed Convection Flow in a Horizontal Duct With Discrete Heat Sources

Qinghua Wang, Yogesh Jaluria
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 13-25, November 11–16, 2001
Paper No: IMECE2001/HTD-24373
DOI: https://doi.org/10.1115/IMECE2001/HTD-24373
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Topics: Ducts, Flow (Dynamics), Heat, Heat transfer, Mixed convection, Cooling, Electronic equipment, Modeling, Reynolds number, Strips
Proceedings Papers

Transient Convective Heat Transfer of Air Jet Impinging Onto a Confined Ceramic-Based MCM Disk

W. S. Su, L. K. Liu, Y. H. Hung
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 27-34, November 11–16, 2001
Paper No: IMECE2001/HTD-24374
DOI: https://doi.org/10.1115/IMECE2001/HTD-24374
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Topics: Air jets, Ceramics, Convection, Disks, Transients (Dynamics), Steady state, Heat transfer, Buoyancy, Heat conduction, Mixed convection
Proceedings Papers

Thermally Optimum Natural Convection Cooled Longitudinal-Plate Heat Sinks With Horizontal Base Plates

K. K. Sikka, C. George
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 35-41, November 11–16, 2001
Paper No: IMECE2001/HTD-24375
DOI: https://doi.org/10.1115/IMECE2001/HTD-24375
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Topics: Heat sinks, Natural convection, Plates (structures), Fins, Flow (Dynamics), Geometry, Heat transfer, Thermal resistance
Proceedings Papers

Effect of Particle Volume Fraction on the Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material

Ravi S. Prasher, Paul Koning, James Shipley, Amit Devpura
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 67-73, November 11–16, 2001
Paper No: IMECE2001/HTD-24379
DOI: https://doi.org/10.1115/IMECE2001/HTD-24379
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Topics: Particulate matter, Stiffness, Thermal conductivity, Percolation theory, Contact resistance, Fillers (Materials), Modeling, Polymers, Viscosity