Topics: Dynamic testing (Materials), Reliability, Solder joints, Dynamic analysis, Failure mechanisms, Solders, Constitutive equations, Cycles, Defense industry, Failure

Topics: Flip-chip devices, Reliability, Solders, Manufacturing, Crack propagation, Delamination, Engineers, Failure mechanisms, Flip-chip assemblies, Optimization

Topics: Computer simulation, Deformation, Holography, Lasers, Manufacturing, Simulation, Surface mount technology, Temperature profiles, Thermal analysis, Thermomechanics

Topics: Adhesives, Microelectronic devices, Surface mount packaging, Solders, Bonding, Electronics, Materials properties, Polymers, Surface mount technology

Topics: Rheology, Solders, Reflow soldering, Electronic components, Melting, Shear rate, Viscosity, Adhesion, Alloys, Creep

Topics: Additive manufacturing, Electronics, Inks, Liquid metals, Packaging, Cycles, Manufacturing, Wire, Circuits, Electrical properties

Topics: Printed circuit boards, Wave soldering, Waves, Alloys, Capillarity, Conveyor systems, Finishes, Inspection, Lead-free solders, Liquid alloys

Topics: Electronics, Manufacturing, Surface mount technology, Testing, Concurrent engineering, Cycles, Engineers, Printed circuit board assemblies, Printed circuit boards, Teams

Topics: Aerospace industry, Defense industry, Performance characterization, Solders, Adhesives, Bearings, Electronics, Military systems, Reliability, Surface mount technology

Topics: Equilibrium (Physics), Finite element analysis, Solders, Stability, Shapes, Solder joints, Stress, Surface tension, Ball-Grid-Array packaging, Finite element methods

Topics: Design, Inspection, Machinery, Solders, Surface mount technology

Topics: Modeling, Reliability, Semiconductor wafers, Lead-free solders, Solders, Testing, Tin, Finite element analysis, Temperature, Alloys

Topics: Durability, Solders, Vibration, Fatigue, Excitation, Failure, Failure analysis, Lumber, Manufacturing, Microscopy