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Proceedings Papers

On the Structure of Turbulent Bubbly Gas-Liquid Flows

Ramendra P. Roy
Proc. ASME. IMECE97, Fluids Engineering, 105-118, November 16–21, 1997
Paper No: IMECE1997-0762
DOI: https://doi.org/10.1115/IMECE1997-0762
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Topics: Flow (Dynamics), Turbulence, Vapors, Boiling, Bubbles, Refrigerants, Fluids, Lasers, Modeling, Nitrogen
Proceedings Papers

Measurement of Two-Phase Mass Flow Rate and Quality Using Venturi and Void Fraction Meters

Luiz F. M. Moura, Christophe Marvillet
Proc. ASME. IMECE97, Fluids Engineering, 363-368, November 16–21, 1997
Paper No: IMECE1997-0793
DOI: https://doi.org/10.1115/IMECE1997-0793
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Topics: Flow (Dynamics), Porosity, Venturi tubes, Pressure drop, Vapors, Pressure instruments, Two-phase flow, Chemical processes, Density, Errors
Proceedings Papers

Fractal Properties of Smoke Produced From Smoldering and Flaming Fires

Charles D. Litton
Proc. ASME. IMECE97, Heat Transfer: Volume 2, 119-133, November 16–21, 1997
Paper No: IMECE1997-0874
DOI: https://doi.org/10.1115/IMECE1997-0874
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Topics: Fire, Fractals, Smoke, Particulate matter, Coal, Diesel engines, Wood products, Albedo, Diesel, Dimensions
Proceedings Papers

In Situ Sensing System for Rapidly Spreading Microdroplets During Droplet-Based Manufacturing

Ho-Young Kim, Taiqing Qiu, Jung-Hoon Chun
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 17-24, November 16–21, 1997
Paper No: IMECE1997-0827
DOI: https://doi.org/10.1115/IMECE1997-0827
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Topics: Drops, Manufacturing, Sensors, Cooling, Microsensors, Solidification, Transients (Dynamics)
Proceedings Papers

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Yifan Guo, Vijay Sarihan, Tom Lee
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 23-27, November 16–21, 1997
Paper No: IMECE1997-1223
DOI: https://doi.org/10.1115/IMECE1997-1223
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Topics: Accelerated life testing, Membranes, Sensors, Reliability, Testing, Failure, High temperature, Stress, Cycles, Deformation
Proceedings Papers

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Y. Zou, J. C. Suhling, R. C. Jaeger, S. T. Lin, L. Nguyen, S. A. Gee
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 15-21, November 16–21, 1997
Paper No: IMECE1997-1222
DOI: https://doi.org/10.1115/IMECE1997-1222
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Topics: Silicon, Stress, Finite element analysis, Temperature, Constitutive equations, Electronic packaging, Engineering simulation, Packaging, Sensors, Shear stress
Proceedings Papers

Hydrostatic Response of Piezoresistive Stress Sensors

Y. Kang, A. K. M. Mian, J. C. Suhling, R. C. Jaeger
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 29-36, November 16–21, 1997
Paper No: IMECE1997-1224
DOI: https://doi.org/10.1115/IMECE1997-1224
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Topics: Hydrostatics, Sensors, Stress, Hydrostatic testing, Resistors, Calibration, Manufacturing, Pressure, Pressure vessels, Semiconductor wafers
Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997
Paper No: IMECE1997-1220
DOI: https://doi.org/10.1115/IMECE1997-1220
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Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors
Proceedings Papers

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 59-67, November 16–21, 1997
Paper No: IMECE1997-1228
DOI: https://doi.org/10.1115/IMECE1997-1228
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Topics: Sensors, Stress, Resistors, Silicon, Anisotropy, Electronic packaging, Heat conduction, Semiconductor wafers, Simulation results, Temperature
Proceedings Papers

Investigation of Boundary Layer Behavior on Single and Tandem Cylinders

T. Lee, A. Panagakos
Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume I, 103-112, November 16–21, 1997
Paper No: IMECE1997-0048
DOI: https://doi.org/10.1115/IMECE1997-0048
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Topics: Boundary layers, Cylinders, Sensors, Circular cylinders, Flow (Dynamics), Flow separation, Pressure measurement, Temperature, Unsteady flow, Vortex shedding
Proceedings Papers

Lift Coefficient Variation on a Cylinder Forced to Oscillate

John E. Bernhardt, Jadran Mihailovic, Carlos F. Jines, Aziz Abouel-Fotouh, Thomas C. Corke, David R. Williams
Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume I, 135-138, November 16–21, 1997
Paper No: IMECE1997-0052
DOI: https://doi.org/10.1115/IMECE1997-0052
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Topics: Cylinders, Microphones, Winding (process), Circuits, Engines, Locks (Waterways), Motors, Oscillations, Phase diagrams, Pressure
Proceedings Papers

Active Feedback Control of Combustion Oscillations

Samir Ziada, Hans R. Graf
Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume II, 329-338, November 16–21, 1997
Paper No: IMECE1997-0127
DOI: https://doi.org/10.1115/IMECE1997-0127
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Topics: Combustion, Feedback, Oscillations, Acoustics, Combustion chambers, Flames, Resonance, Actuators, Control systems, Fuels
Proceedings Papers

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

Charan K. Gurumurthy, Jinbao Jiao, Larry G. Norris, Chung-Yuen Hui, Edward J. Kramer
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 41-47, November 16–21, 1997
Paper No: IMECE1997-0498
DOI: https://doi.org/10.1115/IMECE1997-0498
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Topics: Cantilever beams, Cycles, Delamination, Displacement, Failure, Fatigue, Fatigue testing, Fibers, Flow (Dynamics), Fracture (Materials)
Proceedings Papers

Acoustic Identification of a Spun Cone Roller Bearing Defect

Gerald B. Anderson, Richard L. Smith
Proc. ASME. IMECE97, Rail Transportation, 19-25, November 16–21, 1997
Paper No: IMECE1997-0589
DOI: https://doi.org/10.1115/IMECE1997-0589
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Topics: Acoustics, Roller bearings, Bearings, Press fits, Railroads, Sensors, Spin (Aerodynamics), Spinning (Textile)
Proceedings Papers

Mode Coupling Theory for Evanescent Wave Optical Fiber Sensors

Richard S. Parnas, Dara L. Woerdeman
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 177-187, November 16–21, 1997
Paper No: IMECE1997-0628
DOI: https://doi.org/10.1115/IMECE1997-0628
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Topics: Fiber optic sensors, Optical fiber, Sensors, Waves, Fibers, Signals, Composite materials, Fluorescence, Hinges, In-service inspection
Proceedings Papers

Sensor/Model Fusion for Improved Process Understanding and Control in Injection Molding

Li-Jen Chien, Charles L. Thomas, Del R. Lawson
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 189-197, November 16–21, 1997
Paper No: IMECE1997-0629
DOI: https://doi.org/10.1115/IMECE1997-0629
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Topics: Injection molding, Sensors, Molding, Pressure sensors, Ultrasonic transducers, Cavities, Machinery, Polymers, Signals, Temperature
Proceedings Papers

Real-Time Resin Temperature Measurements for Polymer Processing Using Fluorescence Spectroscopy

Anthony J. Bur, Kalman Migler, Mark G. Vangel, David S. Johnsonbaugh
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 199-211, November 16–21, 1997
Paper No: IMECE1997-0630
DOI: https://doi.org/10.1115/IMECE1997-0630
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Topics: Fluorescence spectroscopy, Polymers, Resins, Temperature measurement, Temperature, Fluorescence, Sensors, Temperature profiles, Crystallization, Excitation
Proceedings Papers

Non-Uniqueness of Two Inverse Problems of Thermally and Force-Loaded Smart Structures: Sensor Shaping and Actuator Shaping Problem

Hans Irschik, Alexander K. Belyaev, Michael Krommer, Kurt Schlacher
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 119-125, November 16–21, 1997
Paper No: IMECE1997-0715
DOI: https://doi.org/10.1115/IMECE1997-0715
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Topics: Actuators, Inverse problems, Sensors, Smart structures, Shapes, Bending (Stress), Piezoelectric actuators, Thermoelasticity, Vibration
Proceedings Papers

Monitoring Technology for Achieving Intelligent Grinding System

Ichiro Inasaki
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 75-81, November 16–21, 1997
Paper No: IMECE1997-1078
DOI: https://doi.org/10.1115/IMECE1997-1078
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Topics: Grinding, Sensors, Wheels, Acoustic emissions, Monitoring systems, Abrasives, Artificial intelligence, Databases, Genetic algorithms, Reliability
Proceedings Papers

Online Estimation of Surface Roughness by Recurrent Fuzzy Inference in Grinding Process

Futoshi Kobayashi, Fumihito Arai, Toshio Fukuda, Makoto Onoda, Norimasa Marui
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 49-54, November 16–21, 1997
Paper No: IMECE1997-1074
DOI: https://doi.org/10.1115/IMECE1997-1074
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Topics: Grinding, Surface roughness, Manufacturing systems, Sensors, Shapes