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Proceedings Papers

Serial and Parallel Fast-Floquet Analyses in Rotorcraft Aeroelasticity

S. Subramanian, S. Venkataratnam, G. H. Gaonkar
Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume III, 41-58, November 16–21, 1997
Paper No: IMECE1997-0158
DOI: https://doi.org/10.1115/IMECE1997-0158
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Topics: Aeroelasticity, Blades, Computers, Databases, Eigenvalues, Hardware, Reliability, Rotors, Stability
Proceedings Papers

Monitoring Technology for Achieving Intelligent Grinding System

Ichiro Inasaki
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 75-81, November 16–21, 1997
Paper No: IMECE1997-1078
DOI: https://doi.org/10.1115/IMECE1997-1078
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Topics: Grinding, Sensors, Wheels, Acoustic emissions, Monitoring systems, Abrasives, Artificial intelligence, Databases, Genetic algorithms, Reliability
Proceedings Papers

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 431-438, November 16–21, 1997
Paper No: IMECE1997-1120
DOI: https://doi.org/10.1115/IMECE1997-1120
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Topics: Design, Optimization, Shapes, Solders, Mathematical analysis, Reliability, Ball-Grid-Array packaging, Ceramics, Composite materials, Experimental design
Proceedings Papers

Closing the Gap Between CAD/CAM and Machining Process Simulation: A Generic Solution

Hazim A. El-Mounayri, Behnam M. Imani, Mohamed. A. Elbestawi, Allan D. Spence
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 127-134, November 16–21, 1997
Paper No: IMECE1997-1144
DOI: https://doi.org/10.1115/IMECE1997-1144
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Topics: Computer-aided design, Machining, Process simulation, Milling, Cutting, Modeling, Reliability, Simulation
Proceedings Papers

A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems

Alex O. Gibson, Jeffrey L. Stein, Jay F. Tu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 23-30, November 16–21, 1997
Paper No: IMECE1997-1071
DOI: https://doi.org/10.1115/IMECE1997-1071
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Topics: Bearings, Control systems, Design, Machine tool spindles, Stress, Thermomechanics, Roller bearings, Thermal expansion, Centrifugal force, Deflection
Proceedings Papers

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

Xiaohua Wu, Xinyu Dou, Chao-pin Yeh, Karl Waytt
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 391-395, November 16–21, 1997
Paper No: IMECE1997-1115
DOI: https://doi.org/10.1115/IMECE1997-1115
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Topics: Simulation, Solder joints, Geometry, Solders, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation
Proceedings Papers

Applications of Digital Correlation Method to Microscopic Strain Measurement and Materials’ Property Characterization

H. Lu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 423-428, November 16–21, 1997
Paper No: IMECE1997-1119
DOI: https://doi.org/10.1115/IMECE1997-1119
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Topics: Hardware, Manufacturing, Reliability, Resolution (Optics), Strain measurement
Proceedings Papers

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, Chender Haung, C. Z. Chen
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 347-351, November 16–21, 1997
Paper No: IMECE1997-1109
DOI: https://doi.org/10.1115/IMECE1997-1109
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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding
Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997
Paper No: IMECE1997-1111
DOI: https://doi.org/10.1115/IMECE1997-1111
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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings
Proceedings Papers

Effect of Creep Feed Grinding Parameters on Strength and Finish of Alumina

G. Sathyanarayanan, Louis J. Plebani, Hsueh-Ming S. Wang
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 411-415, November 16–21, 1997
Paper No: IMECE1997-0694
DOI: https://doi.org/10.1115/IMECE1997-0694
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Topics: Creep, Finishes, Grinding, Bending strength, Stress, Ceramics, Design, Fracture (Materials), Reliability, Surface roughness
Proceedings Papers

Analytical Simulation of Strength Size Effect in Composite Materials

Ala Tabiei, Jianmin Sun
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 79-91, November 16–21, 1997
Paper No: IMECE1997-0711
DOI: https://doi.org/10.1115/IMECE1997-0711
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Topics: Composite materials, Simulation, Size effect, Failure, Finite element analysis, Numerical analysis, Reliability, Stress, Tensile strength, Theoretical analysis
Proceedings Papers

The Role of Threshold Fatigue Crack Growth in Life Prediction of the Alloy Ti-6Al-2Sn-4Zr-6Mo Under High Cycle Fatigue Spectra

James M. Larsen, Stephan M. Russ, David C. Maxwell, Brian D. Worth
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 443-448, November 16–21, 1997
Paper No: IMECE1997-0744
DOI: https://doi.org/10.1115/IMECE1997-0744
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Topics: Alloys, Fatigue cracks, High cycle fatigue, Spectra (Spectroscopy), Fracture (Materials), Gas turbines, Stress, Airfoils, Low cycle fatigue, Titanium alloys
Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 207-217, November 16–21, 1997
Paper No: IMECE1997-0820
DOI: https://doi.org/10.1115/IMECE1997-0820
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Topics: Epoxy adhesives, Epoxy resins, Fracture toughness, Reliability, Solders, Adhesives, Bonding, Creep, Fatigue, Fracture (Materials)
Proceedings Papers

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Cemal Basaran, Rumpa Chandaroy
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 227-242, November 16–21, 1997
Paper No: IMECE1997-0822
DOI: https://doi.org/10.1115/IMECE1997-0822
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Topics: Dynamic testing (Materials), Reliability, Solder joints, Dynamic analysis, Failure mechanisms, Solders, Constitutive equations, Cycles, Defense industry, Failure
Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997
Paper No: IMECE1997-0818
DOI: https://doi.org/10.1115/IMECE1997-0818
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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds
Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997
Paper No: IMECE1997-0819
DOI: https://doi.org/10.1115/IMECE1997-0819
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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability
Proceedings Papers

Structural Integrity of Optical Fibers in Connectors

Wilton W. King, Bruce G. LeFevre, A. Guy Hardee
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 261-269, November 16–21, 1997
Paper No: IMECE1997-0825
DOI: https://doi.org/10.1115/IMECE1997-0825
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Topics: Epoxy adhesives, Epoxy resins, Fibers, Finite element analysis, Fracture (Materials), Fracture (Process), Optical fiber, Reliability, Stress analysis (Engineering), Structural analysis
Proceedings Papers

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Y. Feng, V. R. Raju, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997
Paper No: IMECE1997-0817
DOI: https://doi.org/10.1115/IMECE1997-0817
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Topics: Failure, Adhesion, Fracture mechanics, Manufacturing, Mechanical behavior, Microelectronic devices, Modeling, Molding, Reliability, Surfaces (Materials)
Proceedings Papers

Design Considerations in Avionics Electronic Packaging

Ali Jamnia, Robert E. Walter
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 1-13, November 16–21, 1997
Paper No: IMECE1997-0810
DOI: https://doi.org/10.1115/IMECE1997-0810
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Topics: Avionics, Design, Electronic packaging, Aeronautics, Aviation, Electronic packages, Engineers, Failure, Finite element methods, Packaging
Proceedings Papers

Vibrotactile Feedback for Industrial Telemanipulators

Jack Tigh Dennerlein, Paul A. Millman, Robert D. Howe
Proc. ASME. IMECE97, Dynamic Systems and Control, 189-195, November 16–21, 1997
Paper No: IMECE1997-0396
DOI: https://doi.org/10.1115/IMECE1997-0396
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Topics: Feedback, Sensors, Engineering prototypes, Plates (structures), Frequency response, Grippers, Haptics, Manipulators, Oscillating frequencies, Reliability