Search Results | IMECE | ASME Digital Collection

1-20 of 410

2 3 4 5

Sort by

Sort Order Select

Proceedings Papers

Non-Destructive Infrared Thermographic Curing Analysis of Polymer Composites

Md Ashiqur Rahman, Javier Becerril, Dipannita Ghosh, Nazmul Islam, Ali Ashraf

Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A035, October 30–November 3, 2022

Paper No: IMECE2022-96116

DOI: https://doi.org/10.1115/IMECE2022-96116

View Paper

Topics: Hardening (Curing), Polymer composites, Fillers (Materials), Plasma desorption mass spectrometry, Temperature, Graphite, Thermography, Additive manufacturing, Composite materials, Graphene

Proceedings Papers

On the Micromechanical Properties of Conventional and 3D-Printed Rebar

Seyed M. Allameh, Alexis Eckart, Jose Fonseca Lopez, Roger Miller, Avery Lenihan, Hadi Allameh

Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A029, October 30–November 3, 2022

Paper No: IMECE2022-94651

DOI: https://doi.org/10.1115/IMECE2022-94651

View Paper

Topics: Additive manufacturing, Reinforced concrete, Reliability, Welding, Concretes, Steel, Construction, Fatigue properties, Gages, Structures

Proceedings Papers

Evaluation of 3D-Printed Gel Using a Flat-Ended Square Indenter

Ana Isabel Delgado, Pengfei Dong, Linxia Gu

Proc. ASME. IMECE2022, Volume 4: Biomedical and Biotechnology; Design, Systems, and Complexity, V004T05A027, October 30–November 3, 2022

Paper No: IMECE2022-95004

DOI: https://doi.org/10.1115/IMECE2022-95004

View Paper

Topics: Additive manufacturing, Stiffness, Dimensions, Biomaterials, Displacement, Finite element analysis, Mechanical properties, Microscale devices

Proceedings Papers

Direct-on-Chip Microscale Jet Array Impingement Cooling With Trapezoid Diversion Columns

Jingshan Yang, Keyong Cheng, Xiulan Huai

Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T11A036, October 30–November 3, 2022

Paper No: IMECE2022-95395

DOI: https://doi.org/10.1115/IMECE2022-95395

View Paper

Topics: Impingement cooling, Microscale devices

Proceedings Papers

Microscopic Study on Heat Transfer and Thermophysical Properties of Composite Material

Osamu Nakabeppu, Masanobu Igeta, Kunio Hijikata

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 287-295, November 16–21, 1997

Paper No: IMECE1997-0854

DOI: https://doi.org/10.1115/IMECE1997-0854

View Paper

Topics: Composite materials, Heat transfer, Carbon reinforced plastics, Resolution (Optics), Atomic force microscopy, Microscale devices, Pressure, Temperature, Visualization, Atmospheric pressure

Proceedings Papers

Characterization of Thin-Film Impact Microactuators

Roger L. Hipwell, Richard S. Muller, Albert P. Pisano

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 87-91, November 16–21, 1997

Paper No: IMECE1997-0944

DOI: https://doi.org/10.1115/IMECE1997-0944

View Paper

Topics: Microactuators, Thin films, Actuators, Design, Displacement, Impulse (Physics), Micromachining, Microscale devices, Momentum

Proceedings Papers

Microstructural Effects on the Machining Performance of Dental Ceramics

D. T. Le, Lixun Qi, Guangming Zhang, Stanley J. Ng

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 245-251, November 16–21, 1997

Paper No: IMECE1997-1098

DOI: https://doi.org/10.1115/IMECE1997-1098

View Paper

Topics: Ceramics, Machining, Bending strength, Chemical properties, Cutting, Force measurement, Fracture (Materials), Fracture (Process), Fracture toughness, Microscale devices

Proceedings Papers

Design, Testing, and Simulation of Microscale Gas Chromatography Columns

Mary L. Hudson, Richard Kottenstette, Carolyn M. Matzke, Greg C. Frye-Mason, Kim A. Shollenberger, Doug R. Adkins, C. Channy Wong

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 207-214, November 15–20, 1998

Paper No: IMECE1998-1244

DOI: https://doi.org/10.1115/IMECE1998-1244

View Paper

Topics: Design, Gas chromatography, Microscale devices, Simulation, Testing, Resolution (Optics), Chemistry, Dimensions, Etching, Plates (structures)

Proceedings Papers

Artificial Micropatterns of Cells on Biocompatible Surfaces

Albert Folch, Mehmet Toner

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 27-30, November 15–20, 1998

Paper No: IMECE1998-1219

DOI: https://doi.org/10.1115/IMECE1998-1219

View Paper

Topics: Biocompatibility, Silicon, Adhesion, Assaying, Biological tissues, Biosensors, Microfabrication, Microscale devices, Polymers, Self-assembly

Proceedings Papers

Numerical Simulation of Radiant Thermal Processing of Bilayer Microcantilevers

Haruna Tada, Ioannis N. Miaoulis, Peter Y. Wong

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 37-44, November 15–20, 1998

Paper No: IMECE1998-1221

DOI: https://doi.org/10.1115/IMECE1998-1221

View Paper

Topics: Computer simulation, Microcantilevers, Semiconductor wafers, Etching, Temperature gradient, Emissivity, Separation (Technology), Temperature, Thin films, Design

Proceedings Papers

Development of an Electromagnetically Actuated Mercury Microvalve

Douglas R. Adkins, C. Channy Wong

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 133-137, November 15–20, 1998

Paper No: IMECE1998-1233

DOI: https://doi.org/10.1115/IMECE1998-1233

View Paper

Topics: Contamination, Design, Drops, Electromagnetic force, Flow (Dynamics), Fluid handling, Gas flow, Microscale devices, Permanent magnets, Sealing (Process)

Proceedings Papers

Tribology on the Macro- to Nanoscales of MEMS Materials: A Review

Bharat Bhushan

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 265-266, November 15–20, 1998

Paper No: IMECE1998-1252

DOI: https://doi.org/10.1115/IMECE1998-1252

View Paper

Topics: Microelectromechanical systems, Tribology, Friction, Silicon, Polysilicon, Microscale devices, Crystals, Wear, Boundary lubrication, Nanoindentation

Proceedings Papers

Microactuation by Continuous Electrowetting Phenomenon and Silicon Deep RIE Process

Junghoon Lee, Chang-Jin “CJ” Kim

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 475-480, November 15–20, 1998

Paper No: IMECE1998-1287

DOI: https://doi.org/10.1115/IMECE1998-1287

View Paper

Topics: Reactive-ion etching, Silicon, Electrolytes, Liquid metals, Microchannels, Microelectromechanical systems, Microscale devices, Slug flows, Surface tension, Design

Proceedings Papers

Cracking of Plates With Randomly Distributed Holes by a Maximum Entropy Method

M. Ostoja-Starzewski, Ahmed Al-Ostaz, I. Jasiuk

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 287-288, November 15–20, 1998

Paper No: IMECE1998-1208

DOI: https://doi.org/10.1115/IMECE1998-1208

View Paper

Topics: Entropy, Fracture (Process), Plates (structures), Fracture (Materials), Aluminum, Brittleness, Damage, Electromagnetic scattering, Epoxy adhesives, Epoxy resins

Proceedings Papers

Heat Transfer Enhancement by Fins in the Microscale Regime

Fu-Chu Chou, Jennifer R. Lukes, Chang-Lin Tien

Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 165-172, November 15–20, 1998

Paper No: IMECE1998-0702

DOI: https://doi.org/10.1115/IMECE1998-0702

View Paper

Topics: Fins, Heat transfer, Microscale devices, Size effect, Thermal conductivity, Microchannels, Design, Flow (Dynamics), Heat, Heat exchangers

Proceedings Papers

Holistic Approach for Problems in Heterogeneous Media

Jacob Fish

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 177-182, November 15–20, 1998

Paper No: IMECE1998-1163

DOI: https://doi.org/10.1115/IMECE1998-1163

View Paper

Topics: Composite materials, Constitutive equations, Fibers, Laminates, Micromechanics (Engineering), Microscale devices, Shells, Stiffness, Structural elements (Construction)

Proceedings Papers

Correlation of Fracture Initiation for Microscale Structures: Free-Standing Silicon and Silicon/Glass Interfaces

Martin L. Dunn, Wan Suwito, Paul E. W. Labossiere, Shawn J. Cunningham

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 157, November 15–20, 1998

Paper No: IMECE1998-1154

DOI: https://doi.org/10.1115/IMECE1998-1154

View Paper

Topics: Fracture (Materials), Fracture (Process), Glass, Microscale devices, Silicon, Stress, Etching, Semiconductor wafers, Anisotropy, Bending (Stress)

Proceedings Papers

Fracture Tracing and Analysis in Silicon and Glass Wafers

Lawrence D. Dyer

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 159-160, November 15–20, 1998

Paper No: IMECE1998-1155

DOI: https://doi.org/10.1115/IMECE1998-1155

View Paper

Topics: Fracture (Materials), Fracture (Process), Glass, Semiconductor wafers, Silicon, Stress, Microscale devices, Rivers, Shear waves, Brittle fracture

Proceedings Papers

Experimental and 2-D Numerical Studies on Micro-Scale Bending of Stainless Steel With Pulsed Laser

Guofei Chen, Xianfan Xu, Chie C. Poon, Andrew C. Tam

Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 49-57, November 15–20, 1998

Paper No: IMECE1998-0689

DOI: https://doi.org/10.1115/IMECE1998-0689

View Paper

Topics: Lasers, Microscale devices, Stainless steel, Materials properties, High temperature, Deformation, Dimensions, Energy resources, Finite element analysis, Laser beams

Proceedings Papers

Molecular Dynamics Study of Solid Thin-Film Thermal Conductivity

Jennifer R. Lukes, Xin-Gang Liang, Chang-Lin Tien

Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 229-240, November 15–20, 1998

Paper No: IMECE1998-0709

DOI: https://doi.org/10.1115/IMECE1998-0709

View Paper

Topics: Molecular dynamics, Thermal conductivity, Thin films, Film thickness, Microscale devices, Phonons, Temperature, Wave interference, Waves

2 3 4 5

NARROW

Non-Destructive Infrared Thermographic Curing Analysis of Polymer Composites

On the Micromechanical Properties of Conventional and 3D-Printed Rebar

Evaluation of 3D-Printed Gel Using a Flat-Ended Square Indenter

Direct-on-Chip Microscale Jet Array Impingement Cooling With Trapezoid Diversion Columns

Microscopic Study on Heat Transfer and Thermophysical Properties of Composite Material

Characterization of Thin-Film Impact Microactuators

Microstructural Effects on the Machining Performance of Dental Ceramics

Design, Testing, and Simulation of Microscale Gas Chromatography Columns

Artificial Micropatterns of Cells on Biocompatible Surfaces

Numerical Simulation of Radiant Thermal Processing of Bilayer Microcantilevers

Development of an Electromagnetically Actuated Mercury Microvalve

Tribology on the Macro- to Nanoscales of MEMS Materials: A Review

Microactuation by Continuous Electrowetting Phenomenon and Silicon Deep RIE Process

Cracking of Plates With Randomly Distributed Holes by a Maximum Entropy Method

Heat Transfer Enhancement by Fins in the Microscale Regime

Holistic Approach for Problems in Heterogeneous Media

Correlation of Fracture Initiation for Microscale Structures: Free-Standing Silicon and Silicon/Glass Interfaces

Fracture Tracing and Analysis in Silicon and Glass Wafers

Experimental and 2-D Numerical Studies on Micro-Scale Bending of Stainless Steel With Pulsed Laser

Molecular Dynamics Study of Solid Thin-Film Thermal Conductivity

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only