Search Results | IMECE | ASME Digital Collection

1-20 of 116

2 3 4 5

Sort by

Sort Order Select

Proceedings Papers

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

Qazi S. Ilyas, Ephraim Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 81-88, November 16–21, 1997

Paper No: IMECE1997-0816

DOI: https://doi.org/10.1115/IMECE1997-0816

View Paper

Topics: Failure, Electronic packages, Microelectronic devices, Molding, Optical fiber, Structural analysis

Proceedings Papers

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Y. Feng, V. R. Raju, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997

Paper No: IMECE1997-0817

DOI: https://doi.org/10.1115/IMECE1997-0817

View Paper

Topics: Failure, Adhesion, Fracture mechanics, Manufacturing, Mechanical behavior, Microelectronic devices, Modeling, Molding, Reliability, Surfaces (Materials)

Proceedings Papers

MEMS for Fluidic Controls

Chih-Ming Ho, Yu-Chong Tai

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 27, November 16–21, 1997

Paper No: IMECE1997-0934

DOI: https://doi.org/10.1115/IMECE1997-0934

View Paper

Topics: Microelectromechanical systems, Sensors, Actuators, Circuits, Shear stress, Transducers, Computers, Integrated circuit fabrication, Micromachining, Artificial neural networks

Proceedings Papers

Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners

I. Mohammed, K. M. Liechti

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 91-95, November 16–21, 1997

Paper No: IMECE1997-1232

DOI: https://doi.org/10.1115/IMECE1997-1232

View Paper

Topics: Corners (Structural elements), Fracture (Materials), Nucleation (Physics), Eigenvalues, Stress, Elasticity, Geometry, Microelectronic devices, Structural elements (Construction)

Proceedings Papers

The Effect of Temperature and Humidity Exposure on Adhesion

R. A. Pearson, R. M. Hydro, T. B. Lloyd, H. F. Nied

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 1-6, November 16–21, 1997

Paper No: IMECE1997-0493

DOI: https://doi.org/10.1115/IMECE1997-0493

View Paper

Topics: Adhesion, Temperature, Adhesives, Silver, Copper, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Cantilever beams

Proceedings Papers

Ceramic Tape-Based Meso Systems Technology

Haim H. Bau, Suresh G. K. Ananthasuresh, Jorge J. Santiago-Avilés, Jihua Zhong, Moon Kim, Mingqiang Yi, Patricio Espinoza-Vallejos, Luis Sola-Laguna

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 491-498, November 15–20, 1998

Paper No: IMECE1998-1290

DOI: https://doi.org/10.1115/IMECE1998-1290

View Paper

Topics: Ceramics, Glass, Manufacturing, Silicon, Binders (Materials), Firing, Flow (Dynamics), Lamination, Low temperature, Microelectromechanical systems

Proceedings Papers

Effects of Surface Patterning in Thin Film Structures on the Thermal Radiative Properties During Rapid Thermal Processing

Haruna Tada, Alexis R. Abramson, Ioannis N. Miaoulis, Peter Y. Wong, Patricia Nieva, Paul Zavracky

Proc. ASME. IMECE98, Heat Transfer: Volume 2 — Combustion and Radiation Heat Transfer, 93-98, November 15–20, 1998

Paper No: IMECE1998-0623

DOI: https://doi.org/10.1115/IMECE1998-0623

View Paper

Topics: Rapid thermal processing, Thin films, Semiconductor wafers, Heating, Reflectance, Temperature, Absorption, Computer simulation, Energy gap, High temperature

Proceedings Papers

A Large Stroke, Nanometer Precision X-Y Stage for Lithography

Lowell D. Jones, Jeffrey S. N. Paine

Proc. ASME. IMECE98, Adaptive Structures and Material Systems, 89-94, November 15–20, 1998

Paper No: IMECE1998-0942

DOI: https://doi.org/10.1115/IMECE1998-0942

View Paper

Topics: Lithography, Design, Heat, Actuators, Cables, Flexure mechanisms, Inertia (Mechanics), Innovation, Magnetic levitation, Microelectronic devices

Proceedings Papers

Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry

K. Verma, B. Han

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 93-99, November 15–20, 1998

Paper No: IMECE1998-0434

DOI: https://doi.org/10.1115/IMECE1998-0434

View Paper

Topics: Interferometry, Microelectronic devices, Warping, Surface roughness, Computers, Design for Manufacturing, Infrared radiation, Surface topography

Proceedings Papers

High Fidelity and Compact Models of Synthetic Jets and Their Application in Aerodynamics and Microelectronics

Andrzej J. Przekwas, Zhijian Chen, Marek Turowski

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 475-481, November 14–19, 1999

Paper No: IMECE1999-0308

DOI: https://doi.org/10.1115/IMECE1999-0308

View Paper

Topics: Aerodynamics, Jets, Microelectronic devices, Modeling, Simulation, Aerodynamic flow, Computational fluid dynamics, Computer cooling, Flow (Dynamics), Fluid mechanics

Proceedings Papers

Design and Analysis of a Meso-Scale Refrigerator

N. S. Ashraf, H. C. Carter, III, K. Casey, L. C. Chow, S. Corban, M. K. Drost, A. J. Gumm, Z. Hao, A. Q. Hasan, J. S. Kapat, L. Kramer, M. Newton, K. B. Sundaram, J. Vaidya, C. C. Wong, K. Yerkes

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 109-116, November 14–19, 1999

Paper No: IMECE1999-1068

DOI: https://doi.org/10.1115/IMECE1999-1068

View Paper

Topics: Design, Compression, Engines, Motors, Capacitance, Compressors, Electromagnetic induction, Electronics, Heat, Microelectronic devices

Proceedings Papers

Pool Boiling Heat Transfer From Plain and Microporous, Square Pin Finned Surfaces in Saturated FC-72

K. N. Rainey, S. M. You

Proc. ASME. IMECE99, Heat Transfer: Volume 4, 245-253, November 14–19, 1999

Paper No: IMECE1999-1125

DOI: https://doi.org/10.1115/IMECE1999-1125

View Paper

Topics: Heat transfer, Pool boiling, Critical heat flux, Nucleate boiling, Coating processes, Coatings, Fins, Atmospheric pressure, Bubbles, Density

Proceedings Papers

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Victor Adrian Chiriac, Tien -Yu Tom Lee

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 93-100, November 11–16, 2001

Paper No: IMECE2001/HTD-24382

DOI: https://doi.org/10.1115/IMECE2001/HTD-24382

View Paper

Topics: Design, Gallium arsenide, Temperature, Thermal conductivity, Metals, Computer simulation, Junctions, Microelectronic devices, Packaging, Reliability

Proceedings Papers

Bias-Dependent Peltier Coefficient in Bipolar Devices

Kevin P. Pipe, Rajeev J. Ram, Ali Shakouri

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 219-222, November 11–16, 2001

Paper No: IMECE2001/HTD-24396

DOI: https://doi.org/10.1115/IMECE2001/HTD-24396

View Paper

Topics: Cooling, Design, Diffusion (Physics), Heating, Microelectronic devices, Semiconductor lasers, Temperature, Thermoelectric cooling

Proceedings Papers

Nanoscale Thermal Imaging of Thermionic Devices Using Scanning Thermal Microscopy

Kwong-Luck Tan, Andrew Miner, Xiaofeng Fan, Chris LaBounty, Gehong Zheng, John E. Bowers, Edward T. Croke, Ali Shakouri, Arun Majumdar

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 193-197, November 11–16, 2001

Paper No: IMECE2001/HTD-24393

DOI: https://doi.org/10.1115/IMECE2001/HTD-24393

View Paper

Topics: Imaging, Microscopy, Nanoscale phenomena, Coolers, Cooling, Superlattices, Temperature, Thermocouples, Microelectronic devices, Optoelectronic devices

Proceedings Papers

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien -Yu Tom Lee, Jorge Luis Rosales

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 81-89, November 11–16, 2001

Paper No: IMECE2001/HTD-24381

DOI: https://doi.org/10.1115/IMECE2001/HTD-24381

View Paper

Topics: Air jets, Cooling, Microelectronic devices, Heat transfer, Channel flow, Flow (Dynamics), High temperature, Reynolds number, Buckling, Engineering simulation

Proceedings Papers

Small Heat Source Effects in Sub-Micron Heat Conduction

Sreekant V. J. Narumanchi, Jayathi Y. Murthy, Cristina H. Amon

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 237-238, November 11–16, 2001

Paper No: IMECE2001/HTD-24399

DOI: https://doi.org/10.1115/IMECE2001/HTD-24399

View Paper

Topics: Heat, Heat conduction, Phonons, Dimensions, Mean free path, Approximation, Electric fields, Electromagnetic scattering, Failure, Finite volume methods

Proceedings Papers

Diamond and Diamondlike Composites

R. J. Narayan, Q. Wei, J. Sankar, J. Narayan

Proc. ASME. IMECE2001, Effects of Processing on Properties of Advanced Ceramics, 37-48, November 11–16, 2001

Paper No: IMECE2001/MD-24804

DOI: https://doi.org/10.1115/IMECE2001/MD-24804

View Paper

Topics: Composite materials, Diamonds, Adhesion, Bonding, Carbon, Ceramics, Coatings, Metals, Thin films, Biomedicine

Proceedings Papers

Stress Relaxation of Gold/Polysilicon Layered MEMS Microstructures Subjected to Thermal Loading

Yanhang Zhang, Martin L. Dunn

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 149-156, November 11–16, 2001

Paper No: IMECE2001/MEMS-23822

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23822

View Paper

Topics: Microelectromechanical systems, Polysilicon, Relaxation (Physics), Stress, Temperature, Cooling, Creep, Cycles, Deformation, Microelectronic devices

Proceedings Papers

Issues and Directions of MEMS Research for the Electronics Industry

Y. Eugene Pak

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 3-8, November 11–16, 2001

Paper No: IMECE2001/MEMS-23800

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23800

View Paper

Topics: Electronics, Microelectromechanical systems, Biotechnology, Electromechanical systems, Machining, Manufacturing, Microelectronic devices

2 3 4 5

NARROW

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

MEMS for Fluidic Controls

Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners

The Effect of Temperature and Humidity Exposure on Adhesion

Ceramic Tape-Based Meso Systems Technology

Effects of Surface Patterning in Thin Film Structures on the Thermal Radiative Properties During Rapid Thermal Processing

A Large Stroke, Nanometer Precision X-Y Stage for Lithography

Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry

High Fidelity and Compact Models of Synthetic Jets and Their Application in Aerodynamics and Microelectronics

Design and Analysis of a Meso-Scale Refrigerator

Pool Boiling Heat Transfer From Plain and Microporous, Square Pin Finned Surfaces in Saturated FC-72

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Bias-Dependent Peltier Coefficient in Bipolar Devices

Nanoscale Thermal Imaging of Thermionic Devices Using Scanning Thermal Microscopy

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Small Heat Source Effects in Sub-Micron Heat Conduction

Diamond and Diamondlike Composites

Stress Relaxation of Gold/Polysilicon Layered MEMS Microstructures Subjected to Thermal Loading

Issues and Directions of MEMS Research for the Electronics Industry

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only