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Proceedings Papers

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Xiang Dai, Mark V. Brillhart, Paul S. Ho

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997

Paper No: IMECE1997-0506

DOI: https://doi.org/10.1115/IMECE1997-0506

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Topics: Adhesion, Flip-chip packages, Delamination, Failure, Flip-chip, Flip-chip assemblies, Fracture mechanics, Junctions, Manufacturing, Polymers

Proceedings Papers

Electrical Signal Transmission in a Bone Cell Network: The Influence of a Discrete Gap Junction

Dajun Zhang, Sheldon Weinbaum, Stephen C. Cowin

Proc. ASME. IMECE97, Advances in Bioengineering, 181-182, November 16–21, 1997

Paper No: IMECE1997-0288

DOI: https://doi.org/10.1115/IMECE1997-0288

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Topics: Bone, Junctions, Signals, Cables, Membranes, Biological tissues, Fibers, Geometry, Leakage, Osteoblasts

Proceedings Papers

Vein Cuffs May Improve Anastomotic Patency by Reducing Suture-Line Intramural Stresses

Peter D. Ballyk, Matadial Ojha, Colin Walsh

Proc. ASME. IMECE97, Advances in Bioengineering, 121-122, November 16–21, 1997

Paper No: IMECE1997-0258

DOI: https://doi.org/10.1115/IMECE1997-0258

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Topics: Diseases, Failure, Junctions, Muscle, Stress, Surgery, Thrombosis, Vessels

Proceedings Papers

Mechanisms of Heat Transfer Enhancement in a Turbulent Boundary Layer Downstream of a Cylinder-Wall Junction

Donald E. Wroblewski, Qi Xie

Proc. ASME. IMECE97, Heat Transfer: Volume 3, 21-28, November 16–21, 1997

Paper No: IMECE1997-0890

DOI: https://doi.org/10.1115/IMECE1997-0890

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Topics: Boundary layer turbulence, Cylinders, Heat transfer, Junctions, Heat transfer coefficients, Sensors, Boundary layers, Eddies (Fluid dynamics), Flow (Dynamics), Fluids

Proceedings Papers

Relationship of Flow Disturbances in Stented Vessels to Compliance Mismatch

Joel L. Berry, James E. Moore, Jr., Ralph W. Barnes

Proc. ASME. IMECE97, Advances in Bioengineering, 103-104, November 16–21, 1997

Paper No: IMECE1997-0249

DOI: https://doi.org/10.1115/IMECE1997-0249

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Topics: Flow (Dynamics), Vessels, Stents, Design, Pressure, Reflection, Vortices, Waves, Blood, Blood vessels

Proceedings Papers

A New Approach to Understanding Starling’s Law at the Microstructural Level

Xiaping Hu, Fitzroy Curry, Sheldon Weinbaum

Proc. ASME. IMECE97, Advances in Bioengineering, 73, November 16–21, 1997

Paper No: IMECE1997-0234

DOI: https://doi.org/10.1115/IMECE1997-0234

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Topics: Absorption, Biological tissues, Filtration, Flow (Dynamics), Fluid dynamics, Hydrostatics, Junctions, Membranes, Osmosis, Plasmas (Ionized gases)

Proceedings Papers

An Approach of Exergoeconomic Analysis of Thermal Systems

Si-Moon Kim, Si-Doek Oh, Yong-Ho Kwon, Ho-Young Kwak

Proc. ASME. IMECE97, Advanced Energy Systems, 181-196, November 16–21, 1997

Paper No: IMECE1997-0988

DOI: https://doi.org/10.1115/IMECE1997-0988

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Topics: Exergoeconomic analysis, Thermal systems, Exergy, Combined heat and power, Flow (Dynamics), Design, Economic analysis, Entropy, Gas turbines, Junctions

Proceedings Papers

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

K. Ramakrishna, J. R. Trent

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 13-21, November 16–21, 1997

Paper No: IMECE1997-1210

DOI: https://doi.org/10.1115/IMECE1997-1210

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Topics: Automotive industry, Ball-Grid-Array packaging, Temperature, Junctions, Printed circuit boards, Computational fluid dynamics, Thermal conductivity, Heat transfer, Transients (Dynamics), Energy dissipation

Proceedings Papers

Transient Thermal Analysis of Outdoor Electronic Equipment

L. T. Yeh

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 65-73, November 16–21, 1997

Paper No: IMECE1997-1215

DOI: https://doi.org/10.1115/IMECE1997-1215

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Topics: Electronic equipment, Thermal analysis, Transients (Dynamics), Temperature, Cycles, Design, Electronic components, Flow (Dynamics), Junctions, Reliability

Proceedings Papers

Isothermal Flow Distribution in Coupled Manifolds: Comparison of Results From CFD and an Integral Model

G. F. Jones, J. M. Galliera

Proc. ASME. IMECE98, Fluids Engineering, 189-195, November 15–20, 1998

Paper No: IMECE1998-1003

DOI: https://doi.org/10.1115/IMECE1998-1003

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Topics: Computational fluid dynamics, Flow (Dynamics), Manifolds, Engineering simulation, Pipeline risers, Pressure, Risers (Casting), Simulation, Turbulence, Computers

Proceedings Papers

An Experimental Model for Investigating Mechanotransduction in Cells: Formation of 3-D Colonies and Differentiation of Cells in the Presence of a Force-Conducting Ligand

Rajendra S. Bhatnagar, Jing Jing Qian, Anna Wedrychowska, Nancy Smith

Proc. ASME. IMECE98, Advances in Heat and Mass Transfer in Biotechnology, 91-94, November 15–20, 1998

Paper No: IMECE1998-0802

DOI: https://doi.org/10.1115/IMECE1998-0802

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Topics: Biological tissues, Fibers, Heat conduction, Junctions, Physiology, Reduced gravity environments, Signals, Tissue engineering

Proceedings Papers

Temperature Effect on Power MOSFET Devices

W. Lu, L. C. Chow, K. B. Sundaram

Proc. ASME. IMECE98, Advanced Energy Systems, 467-473, November 15–20, 1998

Paper No: IMECE1998-0875

DOI: https://doi.org/10.1115/IMECE1998-0875

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Topics: MOSFET transistors, Temperature, Thermal resistance, Junctions, Heat, Operating temperature, Cooling, Circuits, Heat sinks, Low temperature

Proceedings Papers

Virtual Fabrication of an 0.25 um Integrated Circuit Device Using TCAD

Chi-Te Chin, James N. Fordemwalt, Jong-I Mou

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 53-58, November 15–20, 1998

Paper No: IMECE1998-1015

DOI: https://doi.org/10.1115/IMECE1998-1015

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Topics: Circuits, Complementary metal oxide semiconductors, Computer-aided design, Delays, Diffusion (Physics), Gates (Closures), Integrated circuits, Junctions, Manufacturing, Metal oxide semiconductors

Proceedings Papers

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sanjeev B. Sathe, Bahgat G. Sammakia

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 747-756, November 15–20, 1998

Paper No: IMECE1998-1089

DOI: https://doi.org/10.1115/IMECE1998-1089

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Topics: Accounting, Adhesives, Ball-Grid-Array packaging, Construction, Convection, Design, Flat heat pipes, Geometry, Heat conduction, Heat sinks

Proceedings Papers

A Numerical Hybrid Finite Element Model for Lattice Structures Using 3D/Beam Elements

Ahmadali Tahmasebimoradi, Chetra Mang, Xavier Lorang

Proc. ASME. IMECE2021, Volume 2A: Advanced Manufacturing, V02AT02A061, November 1–5, 2021

Paper No: IMECE2021-69119

DOI: https://doi.org/10.1115/IMECE2021-69119

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Topics: Finite element model, Microbeams, Junctions, Additive manufacturing, Deformation, Engineering simulation, Plasticity, Shapes, Simulation, Surface roughness

Proceedings Papers

Phonon Scattering From Carbon Nanotube and Graphene Junction Under Mechanical Deformation

Ian Durr, Matheus Prates, Jungkyu Park

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A086, November 1–5, 2021

Paper No: IMECE2021-70349

DOI: https://doi.org/10.1115/IMECE2021-70349

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Topics: Carbon nanotubes, Deformation, Electromagnetic scattering, Graphene, Junctions, Phonons, Radiation scattering, Scattering (Physics)

Proceedings Papers

Numerical Modeling of a T-Junction Static Micromixer With a Periodic Porous Architecture

Mahmoud A. Alzoubi, Oraib Al-Ketan, Jayaveera Muthusamy, Agus Sasmito, Sébastien Poncet

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A007, November 1–5, 2021

Paper No: IMECE2021-69136

DOI: https://doi.org/10.1115/IMECE2021-69136

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Topics: Additive manufacturing, Computer simulation, Design, Diffusion (Physics), Drugs, Flow (Dynamics), Junctions, Manufacturing, Microchannels, Momentum

Proceedings Papers

Fluid-Induced Shear Stress Stimulates Ca 2+ Signaling in Human Tendon Epitenon Cells

Eric Francke, Michelle K. Elfervig, Ajay Sood, Thomas D. Brown, Donald K. Bynum, Albert J. Banes

Proc. ASME. IMECE99, Advances in Bioengineering, 109-110, November 14–19, 1999

Paper No: IMECE1999-0401

DOI: https://doi.org/10.1115/IMECE1999-0401

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Topics: Fluids, Shear stress, Tendons, Biological tissues, Cell membranes, Cultured cells, Deformation, DNA, Junctions, Laminar flow

Proceedings Papers

On the Modeling of the Wheatstone-Bridge Piezoresistive Pressure Sensor: A Finite-Element-Based Approach

Chahid K. Ghaddar, John R. Gilbert

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 195-200, November 14–19, 1999

Paper No: IMECE1999-0267

DOI: https://doi.org/10.1115/IMECE1999-0267

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Topics: Bridges (Structures), Modeling, Pressure sensors, Resistors, Design, Diaphragms (Mechanical devices), Diaphragms (Structural), Diffusion (Physics), Dimensions, Engineering simulation

Proceedings Papers

Integrated Mixing/Reaction Micro Flow Cell for Chemical and Biochemical Applications

Ryosuke Nakamura, Shuichi Shoji, Akira Yotsumoto

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 265-268, November 14–19, 1999

Paper No: IMECE1999-0278

DOI: https://doi.org/10.1115/IMECE1999-0278

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Topics: Flow (Dynamics), Temperature control, Feedback, Junctions, Light, Microchannels, Plasma desorption mass spectrometry, Slabs, Temperature sensors, Thin films

2 3 4 5

NARROW

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Electrical Signal Transmission in a Bone Cell Network: The Influence of a Discrete Gap Junction

Vein Cuffs May Improve Anastomotic Patency by Reducing Suture-Line Intramural Stresses

Mechanisms of Heat Transfer Enhancement in a Turbulent Boundary Layer Downstream of a Cylinder-Wall Junction

Relationship of Flow Disturbances in Stented Vessels to Compliance Mismatch

A New Approach to Understanding Starling’s Law at the Microstructural Level

An Approach of Exergoeconomic Analysis of Thermal Systems

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

Transient Thermal Analysis of Outdoor Electronic Equipment

Isothermal Flow Distribution in Coupled Manifolds: Comparison of Results From CFD and an Integral Model

An Experimental Model for Investigating Mechanotransduction in Cells: Formation of 3-D Colonies and Differentiation of Cells in the Presence of a Force-Conducting Ligand

Temperature Effect on Power MOSFET Devices

Virtual Fabrication of an 0.25 um Integrated Circuit Device Using TCAD

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

A Numerical Hybrid Finite Element Model for Lattice Structures Using 3D/Beam Elements

Phonon Scattering From Carbon Nanotube and Graphene Junction Under Mechanical Deformation

Numerical Modeling of a T-Junction Static Micromixer With a Periodic Porous Architecture

Fluid-Induced Shear Stress Stimulates Ca 2+ Signaling in Human Tendon Epitenon Cells

On the Modeling of the Wheatstone-Bridge Piezoresistive Pressure Sensor: A Finite-Element-Based Approach

Integrated Mixing/Reaction Micro Flow Cell for Chemical and Biochemical Applications

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