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Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997
Paper No: IMECE1997-0818
DOI: https://doi.org/10.1115/IMECE1997-0818
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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds
Proceedings Papers

Design Considerations in Avionics Electronic Packaging

Ali Jamnia, Robert E. Walter
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 1-13, November 16–21, 1997
Paper No: IMECE1997-0810
DOI: https://doi.org/10.1115/IMECE1997-0810
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Topics: Avionics, Design, Electronic packaging, Aeronautics, Aviation, Electronic packages, Engineers, Failure, Finite element methods, Packaging
Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997
Paper No: IMECE1997-1117
DOI: https://doi.org/10.1115/IMECE1997-1117
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Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding
Proceedings Papers

Prediction of the Solder Joint Configuration Under Various Geometric Parameters

Wei-Long Chen, Bor-Lin Shyu, Kuo-Ning Chiang
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 397-400, November 16–21, 1997
Paper No: IMECE1997-1116
DOI: https://doi.org/10.1115/IMECE1997-1116
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Topics: Solder joints, Shapes, Electronic packaging, Energy conservation, Gravity (Force), Numerical analysis, Shape design, Solders, Surface tension, Weight (Mass)
Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997
Paper No: IMECE1997-1111
DOI: https://doi.org/10.1115/IMECE1997-1111
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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings
Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997
Paper No: IMECE1997-1231
DOI: https://doi.org/10.1115/IMECE1997-1231
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Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging
Proceedings Papers

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Y. Zou, J. C. Suhling, R. C. Jaeger, S. T. Lin, L. Nguyen, S. A. Gee
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 15-21, November 16–21, 1997
Paper No: IMECE1997-1222
DOI: https://doi.org/10.1115/IMECE1997-1222
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Topics: Silicon, Stress, Finite element analysis, Temperature, Constitutive equations, Electronic packaging, Engineering simulation, Packaging, Sensors, Shear stress
Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997
Paper No: IMECE1997-1229
DOI: https://doi.org/10.1115/IMECE1997-1229
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Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena
Proceedings Papers

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Bernd Michel, Dietmar Vogel, Andreas Schubert, Jürgen Auersperg, Herbert Reichl
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 117-123, November 16–21, 1997
Paper No: IMECE1997-1236
DOI: https://doi.org/10.1115/IMECE1997-1236
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Topics: Algorithms, Computers, Displacement, Displacement measurement, Electron microscopy, Electronic packaging, Engineering simulation, Failure, Finite element analysis, Flip-chip assemblies
Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997
Paper No: IMECE1997-1237
DOI: https://doi.org/10.1115/IMECE1997-1237
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Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing
Proceedings Papers

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 59-67, November 16–21, 1997
Paper No: IMECE1997-1228
DOI: https://doi.org/10.1115/IMECE1997-1228
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Topics: Sensors, Stress, Resistors, Silicon, Anisotropy, Electronic packaging, Heat conduction, Semiconductor wafers, Simulation results, Temperature
Proceedings Papers

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

Andrew J. Scholand, Russell S. Peak, Robert E. Fulton
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 23-31, November 16–21, 1997
Paper No: IMECE1997-1211
DOI: https://doi.org/10.1115/IMECE1997-1211
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Topics: Electronic packaging, Manufacturing, Printed circuit boards, Product quality, Warping, Ovens, Economics , Materials properties, Temperature, Thermomechanics
Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997
Paper No: IMECE1997-0515
DOI: https://doi.org/10.1115/IMECE1997-0515
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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing
Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Paper No: IMECE1997-0499
DOI: https://doi.org/10.1115/IMECE1997-0499
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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip
Proceedings Papers

Filler Dispersion Measurements Within Thermal Management Materials for Electronic Applications

Nancy E. Mathis
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 37-41, November 14–19, 1999
Paper No: IMECE1999-0968
DOI: https://doi.org/10.1115/IMECE1999-0968
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Topics: Fillers (Materials), Thermal management, Electronic packaging, Fibers, Thermal conductivity
Proceedings Papers

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

Andrei G. Fedorov, Raymond Viskanta
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 89-98, November 14–19, 1999
Paper No: IMECE1999-1066
DOI: https://doi.org/10.1115/IMECE1999-1066
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Topics: Cooling, Electronic components, Heat sinks, Heat transfer, Microchannels, Fluids, Design, Electronic packaging, Energy conservation, Flow (Dynamics)
Proceedings Papers

Development and Characterisation of a Oxazolidone-Isocyanurate-Urethane Modified Diglycidyl Ether of Bisphenol A Epoxy Resin

K. S. Chian, S. Yi
Proc. ASME. IMECE99, Polymeric Systems, 51-56, November 14–19, 1999
Paper No: IMECE1999-1204
DOI: https://doi.org/10.1115/IMECE1999-1204
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Topics: Epoxy resins, Ethers (Class of compounds), Urethane elastomers, Resins, Rubber, Adhesives, Fracture toughness, Thermal stability, Aerospace industry, Bearings
Proceedings Papers

Precision Alignment Packaging for Microsystems With Multiple Fluid Connections

Paul Galambos, Gilbert L. Benavides, Murat Okandan, Mark W. Jenkins, Dale Hetherington
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 723-730, November 11–16, 2001
Paper No: IMECE2001/MEMS-23902
DOI: https://doi.org/10.1115/IMECE2001/MEMS-23902
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Topics: Fluids, Microelectromechanical systems, Packaging, Microfluidics, Adhesives, Electronic packaging, Flip-chip, Flip-chip devices, Flow (Dynamics), Leakage
Proceedings Papers

Dynamic Characterization of Shape Memory Alloys for Integration With Electronic Packaging

Shivananda P. Mizar, Ryszard J. Pryputniewicz
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 213-217, November 11–16, 2001
Paper No: IMECE2001/EPP-24727
DOI: https://doi.org/10.1115/IMECE2001/EPP-24727
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Topics: Electronic packaging, Shape memory alloys
Proceedings Papers

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Peng Zhou, Kenneth E. Goodson
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 51-57, November 11–16, 2001
Paper No: IMECE2001/HTD-24377
DOI: https://doi.org/10.1115/IMECE2001/HTD-24377
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Topics: Integrated circuits, Junctions, Modeling, Pressure, Thermal resistance, Electronic packages, Transients (Dynamics), Electronic packaging, Experimental methods, Fillers (Materials)