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Proceedings Papers

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

Qazi S. Ilyas, Ephraim Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 81-88, November 16–21, 1997

Paper No: IMECE1997-0816

DOI: https://doi.org/10.1115/IMECE1997-0816

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Topics: Failure, Electronic packages, Microelectronic devices, Molding, Optical fiber, Structural analysis

Proceedings Papers

Design Considerations in Avionics Electronic Packaging

Ali Jamnia, Robert E. Walter

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 1-13, November 16–21, 1997

Paper No: IMECE1997-0810

DOI: https://doi.org/10.1115/IMECE1997-0810

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Topics: Avionics, Design, Electronic packaging, Aeronautics, Aviation, Electronic packages, Engineers, Failure, Finite element methods, Packaging

Proceedings Papers

Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package

D. Angirasa, F. Pyrtle, III, G. P. Peterson

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 279-285, November 16–21, 1997

Paper No: IMECE1997-0853

DOI: https://doi.org/10.1115/IMECE1997-0853

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Topics: Cooling, Electronic packages, Heat sinks, Temperature, Aluminum, Computer cooling, Heat, Heat transfer, Porosity, Reynolds number

Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997

Paper No: IMECE1997-1111

DOI: https://doi.org/10.1115/IMECE1997-1111

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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings

Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997

Paper No: IMECE1997-1231

DOI: https://doi.org/10.1115/IMECE1997-1231

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Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging

Proceedings Papers

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Xiaoyuan He, Daqing Zou, Sheng Liu, Yifan Guo

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 97-103, November 16–21, 1997

Paper No: IMECE1997-1233

DOI: https://doi.org/10.1115/IMECE1997-1233

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Topics: Interferometry, Displacement, Computer software, Phase diagrams, Computer programming, Deformation, Diffraction gratings, Electronic packages, Flip-chip

Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997

Paper No: IMECE1997-1220

DOI: https://doi.org/10.1115/IMECE1997-1220

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Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors

Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997

Paper No: IMECE1997-0515

DOI: https://doi.org/10.1115/IMECE1997-0515

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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing

Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997

Paper No: IMECE1997-0508

DOI: https://doi.org/10.1115/IMECE1997-0508

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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination

Proceedings Papers

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 61-71, November 16–21, 1997

Paper No: IMECE1997-0501

DOI: https://doi.org/10.1115/IMECE1997-0501

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Topics: Failure, Flip-chip packages, Stress, Design, Electronic packages, Thermomechanics, Adhesive joints, Cracking (Materials), Fillers (Materials), Finite element analysis

Proceedings Papers

Process Modeling and Interfacial Behavior in the VSPA Package

Richard Harries, Suresh Sitaraman

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 293-299, November 16–21, 1997

Paper No: IMECE1997-0676

DOI: https://doi.org/10.1115/IMECE1997-0676

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Topics: Delamination, Electronic packages, Failure mechanisms, Finite element model, Fracture (Materials), Fracture mechanics, Geometry, Manufacturing, Materials properties, Modeling

Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998

Paper No: IMECE1998-0429

DOI: https://doi.org/10.1115/IMECE1998-0429

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Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers

Proceedings Papers

Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 101-106, November 15–20, 1998

Paper No: IMECE1998-0435

DOI: https://doi.org/10.1115/IMECE1998-0435

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Topics: Flip-chip assemblies, Stress analysis (Engineering), Stress, Reliability, Cycles, Accelerated life testing, Electronic packages, Failure, Manufacturing, Simulation models

Proceedings Papers

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

V. H. Adams, K. Ramakrishna

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 99-106, November 14–19, 1999

Paper No: IMECE1999-0922

DOI: https://doi.org/10.1115/IMECE1999-0922

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Topics: Electronic packages, Heating, Performance characterization, Silicon, Heat, Temperature, Thermal characterization, Ball-Grid-Array packaging, Engineering simulation, Junctions

Proceedings Papers

Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages

Bahgat Sammakia, Koneru Ramakrishna, Frank Andros, Jayathi Y. Murthy, Vijay Sarihan, D. H. R. Sarma, Sanjeev Sathe

Proc. ASME. IMECE2001, Manufacturing Engineering, 461-463, November 11–16, 2001

Paper No: IMECE2001/MED-23350

DOI: https://doi.org/10.1115/IMECE2001/MED-23350

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Topics: Adhesives, Computer cooling, Computer simulation, Computers, Concurrent engineering, Design, Drilling, Electronic packages, Electronics, Engineering design processes

Proceedings Papers

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Peng Zhou, Kenneth E. Goodson

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 51-57, November 11–16, 2001

Paper No: IMECE2001/HTD-24377

DOI: https://doi.org/10.1115/IMECE2001/HTD-24377

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Topics: Integrated circuits, Junctions, Modeling, Pressure, Thermal resistance, Electronic packages, Transients (Dynamics), Electronic packaging, Experimental methods, Fillers (Materials)

Proceedings Papers

Mechanics Issues at Micro-Scale Modeling of Electronic Packages

Raghuram V. Pucha, Gnyaneshwar Ramakrishna, Suresh K. Sitaraman

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 73-82, November 11–16, 2001

Paper No: IMECE2001/EPP-24709

DOI: https://doi.org/10.1115/IMECE2001/EPP-24709

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Topics: Cycles, Deformation, Electronic packages, Electronic packaging, Fatigue, Fatigue life, Materials properties, Microscale devices, Modeling, Plasticity

Proceedings Papers

Design Features of Compliant Packages and Their Impact on Reliability

Ilyas Mohammed, Young-Gon Kim

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 43-52, November 11–16, 2001

Paper No: IMECE2001/EPP-24705

DOI: https://doi.org/10.1115/IMECE2001/EPP-24705

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Topics: Design, Reliability, Silicon, Packaging, Accelerated life testing, Electronic packages, Epoxy adhesives, Epoxy resins, Event history analysis, Failure

Proceedings Papers

Mechanical Considerations of Shin-Etsu Elastomer As a Z-Axis Interconnect

C. Cox, W. F. Schmidt, M. H. Gordon, W. Marsh, G. Bates, M. Lucas

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 277-281, November 11–16, 2001

Paper No: IMECE2001/EPP-24736

DOI: https://doi.org/10.1115/IMECE2001/EPP-24736

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Topics: Elastomers, Compression, Young's modulus, Accounting, Boundary-value problems, Composite materials, Copper, Design, Electromagnetic scattering, Electronic packages

Proceedings Papers

Selection of Method for Fatigue Life Prediction Under Random Loading

Amit Awasthi, Stephen Mckeown, C. Sahay, Bahgat Sammakia

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 289-304, November 11–16, 2001

Paper No: IMECE2001/EPP-24738

DOI: https://doi.org/10.1115/IMECE2001/EPP-24738

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Topics: Algorithms, Aluminum, Copper, Cycles, Electronic packages, Fatigue, Fatigue failure, Fatigue life, Fatigue testing, Gaussian distribution

2 3 4

NARROW

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

Design Considerations in Avionics Electronic Packaging

Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Testing and Measurement Techniques Applied to Electronic Packaging Development

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Advances in Stress Test Chips

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

Process Modeling and Interfacial Behavior in the VSPA Package

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Mechanics Issues at Micro-Scale Modeling of Electronic Packages

Design Features of Compliant Packages and Their Impact on Reliability

Mechanical Considerations of Shin-Etsu Elastomer As a Z-Axis Interconnect

Selection of Method for Fatigue Life Prediction Under Random Loading

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