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Proceedings Papers

Development of a High Flux Conduction Calibration Apparatus

William L. Grosshandler, David Blackburn

Proc. ASME. IMECE97, Heat Transfer: Volume 3, 153-158, November 16–21, 1997

Paper No: IMECE1997-0904

DOI: https://doi.org/10.1115/IMECE1997-0904

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Topics: Calibration, Heat conduction, Heat flux, Flux (Metallurgy), Gages, National Institute of Standards and Technology, Uncertainty, Boundary-value problems, Computer simulation, Condensers (steam plant)

Proceedings Papers

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 1 — Study of Contact Area

Chang J. Park, Deborah A. Kaminski

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 89-97, November 16–21, 1997

Paper No: IMECE1997-1218

DOI: https://doi.org/10.1115/IMECE1997-1218

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Topics: Bolted joints, Contact resistance, Plates (structures), Separation (Technology), Calibration, Equations, Finishes, Finite element methods, Materials properties, Metals

Proceedings Papers

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 2 — Study of Thermal Contact Resistance

Chang J. Park, Deborah A. Kaminski

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 99-108, November 16–21, 1997

Paper No: IMECE1997-1219

DOI: https://doi.org/10.1115/IMECE1997-1219

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Topics: Bolted joints, Contact resistance, Plates (structures), Boundary-value problems, Copper, Pressure, Cooling, Design, Finishes, Geometry

Proceedings Papers

Contact Resistance Modeling and Measurements of an Electrostatically Actuated Micromechanical Switch

Sumit Majumder, N. E. McGruer, Paul M. Zavracky, Richard H. Morrison, George G. Adams, Jacqueline Krim

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 341-346, November 15–20, 1998

Paper No: IMECE1998-1265

DOI: https://doi.org/10.1115/IMECE1998-1265

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Topics: Contact resistance, Modeling, Switches, Gates (Closures), Cantilever beams, Coating processes, Coatings, Currents, Cycles, Electrodes

Proceedings Papers

Validation of Methodologies for the Estimation of Blood Perfusion Using a Minimally Invasive Probe

Paul S. Robinson, Elaine P. Scott, Thomas E. Diller

Proc. ASME. IMECE98, Advances in Heat and Mass Transfer in Biotechnology, 109-115, November 15–20, 1998

Paper No: IMECE1998-0805

DOI: https://doi.org/10.1115/IMECE1998-0805

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Topics: Blood, Probes, Biological tissues, Heat flux, Parameter estimation, Flow (Dynamics), Temperature, Air jets, Contact resistance, Phantoms

Proceedings Papers

Detachable Fine Bump Connection Using Multi-Walled Carbon-Nanotube Bundles for 3D Semiconductor Modules

Masasuke Kobayashi, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A005, November 1–5, 2021

Paper No: IMECE2021-70172

DOI: https://doi.org/10.1115/IMECE2021-70172

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Topics: Carbon nanotubes, Ohmic contacts, Semiconductors (Materials), Multi-walled carbon nanotubes, Deformation, Silicon, Chemical vapor deposition, Compression, Contact resistance, Electrical properties

Proceedings Papers

Laser Opto Microactuators Rotated by Molecular Gas Dynamics Effects

Masahiro Ota, Yu-ichi Watanabe, Moriyoshi Sakamoto

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 405-411, November 14–19, 1999

Paper No: IMECE1999-0298

DOI: https://doi.org/10.1115/IMECE1999-0298

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Topics: Gasdynamics, Lasers, Microactuators, Germanium, Rotors, Silicon, Thin films, Aluminum, Oxidation, Reflectance

Proceedings Papers

Thermal Conductivity Measurement of CVD Diamond Films Using a Modified Thermal Comparator Method

Kumar R. Cheruparambil, Bakhtier Farouk, Joseph E. Yehoda, Nelson A. Macken

Proc. ASME. IMECE99, Heat Transfer: Volume 4, 103-111, November 14–19, 1999

Paper No: IMECE1999-1109

DOI: https://doi.org/10.1115/IMECE1999-1109

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Topics: Diamond films, Synthetic diamonds, Thermal conductivity, Thermal conductivity measurement, Calibration, Chemical vapor deposition, Heat transfer, Thermal resistance, Anisotropy, Bulk solids

Proceedings Papers

Three-Dimensional Thermal Model of Resistance Spot Welding in Aluminum

A. A. S. Arefin Kabir, Jamil A. Khan, Kirk Broach

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 371-380, November 14–19, 1999

Paper No: IMECE1999-1094

DOI: https://doi.org/10.1115/IMECE1999-1094

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Topics: Aluminum, Welding, Electrodes, Contact resistance, Convection, Electrical conductance, Computer simulation, Dynamics (Mechanics), Fluids, Geometry

Proceedings Papers

Estimating the Maximum Splat Diameter of a Solidifying Droplet

Nicolas G. Hadjiconstantinou

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 311-316, November 14–19, 1999

Paper No: IMECE1999-0998

DOI: https://doi.org/10.1115/IMECE1999-0998

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Topics: Drops, Solidification, Contact resistance, Dynamics (Mechanics), Energy conservation, Energy dissipation, Freezing, Subcooling, Surface tension

Proceedings Papers

An Apparatus for Measuring the Effective Thermal Conductivity of the Body Surface

Shuxia Cheng, Hongbo Zhang, Dawei Luo, Dayong Gao

Proc. ASME. IMECE99, Advances in Heat and Mass Transfer in Biotechnology, 127-134, November 14–19, 1999

Paper No: IMECE1999-0593

DOI: https://doi.org/10.1115/IMECE1999-0593

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Topics: Thermal conductivity, Wire, Silicone rubber, Temperature, Patient treatment, Platinum, Biological tissues, Biomaterials, Contact resistance, Cooling

Proceedings Papers

The Feasibility of Using Photothermal Deflection Spectroscopy to Measure Thermal Contact Resistance in a Film on Substrate System

Jason R. Foley, C. Thomas Avedisian

Proc. ASME. IMECE2001, Heat Transfer: Volume 4 — Combustion and Energy Systems, 355-360, November 11–16, 2001

Paper No: IMECE2001/HTD-24276

DOI: https://doi.org/10.1115/IMECE2001/HTD-24276

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Topics: Contact resistance, Deflection, Spectroscopy

Proceedings Papers

Damage Assessment in Thermal Barrier Coatings Using Thermal Wave Imaging Technique

X. Chen, G. Newaz, X. Han

Proc. ASME. IMECE2001, Damage Initiation and Prediction in Composites, Sandwich Structures and Thermal Barrier Coatings, 239-246, November 11–16, 2001

Paper No: IMECE2001/AD-25323

DOI: https://doi.org/10.1115/IMECE2001/AD-25323

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Topics: Damage assessment, Imaging, Thermal barrier coatings, Waves, Damage, Cycles, Signals, Buckling, Contact resistance, Delamination

Proceedings Papers

Thermal Modeling of a Liquid-Cooled Electric Machine

Edward Jih, Kanghua Chen, Thomas Abraham, Feng Liang

Proc. ASME. IMECE2001, Heat Transfer: Volume 5 — Computational, Aerospace and Environmental Heat Transfer, 193-200, November 11–16, 2001

Paper No: IMECE2001/HTD-24303

DOI: https://doi.org/10.1115/IMECE2001/HTD-24303

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Topics: Automotive industry, Computational fluid dynamics, Contact resistance, Cooling, Design, Electric motors, Epoxy adhesives, Epoxy resins, Fuel cell vehicles, Heat transfer

Proceedings Papers

A Micro/Macro Integrated Model for Melt Flow and Non-Equilibrium Solidification for Thermal Spraying

X. Y. Wang, H. Zhang, L. L. Zheng, S. Sampath

Proc. ASME. IMECE2001, Heat Transfer: Volume 6 — Heat Transfer in Materials Processing, 339-349, November 11–16, 2001

Paper No: IMECE2001/HTD-24367

DOI: https://doi.org/10.1115/IMECE2001/HTD-24367

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Topics: Equilibrium (Physics), Flow (Dynamics), Metal spraying, Solidification, Contact resistance, Diffusion (Physics), Energy budget (Physics), Fluids, Interpolation, Relational databases

Proceedings Papers

Prediction of Thermal Contact Conductance by Surface Deformation Analysis

Vishal Singhal, Suresh V. Garimella

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 43-50, November 11–16, 2001

Paper No: IMECE2001/HTD-24376

DOI: https://doi.org/10.1115/IMECE2001/HTD-24376

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Topics: Contact resistance, Electrical conductance, Surface deformation

Proceedings Papers

Effect of Particle Volume Fraction on the Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material

Ravi S. Prasher, Paul Koning, James Shipley, Amit Devpura

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 67-73, November 11–16, 2001

Paper No: IMECE2001/HTD-24379

DOI: https://doi.org/10.1115/IMECE2001/HTD-24379

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Topics: Particulate matter, Stiffness, Thermal conductivity, Percolation theory, Contact resistance, Fillers (Materials), Modeling, Polymers, Viscosity

Proceedings Papers

Thermal Contact Resistance of Phase Change and Grease Type Polymeric Materials

Ravi S. Prasher, Craig Simmons, Gary Solbrekken

Proc. ASME. IMECE2000, Manufacturing Engineering, 461-466, November 5–10, 2000

Paper No: IMECE2000-1841

DOI: https://doi.org/10.1115/IMECE2000-1841

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Topics: Contact resistance, Thermal conductivity, Phase change materials, Polymers, Flat heat pipes, Computer cooling, Electronic packages, Fluids, Heat sinks, Particulate matter

Proceedings Papers

Freezing of Molten Solder Droplets Impacting Onto Flat Substrates in Microgravity

Stephan E. Haferl, Vincent Butty, Dimos Poulikakos, Johannes Giannakouros, Kevin Boomsma, Constantine M. Megaridis, Vedha Nayagam

Proc. ASME. IMECE2000, Heat Transfer: Volume 1, 155-166, November 5–10, 2000

Paper No: IMECE2000-1378

DOI: https://doi.org/10.1115/IMECE2000-1378

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Topics: Drops, Freezing, Solders, Solidification, Computer simulation, Gravity (Force), Contact resistance, Deformation, Finite element methods, Fluid dynamics

Proceedings Papers

Experimental Investigation of Contact Resistance Across Pressed Lead and Aluminum Contact in Vacuum

Xiao Ma, Jamil A. Khan, Curtis A. Rhodes, Allen Smith, L. Larry Hamm

Proc. ASME. IMECE2000, Heat Transfer: Volume 2, 155-162, November 5–10, 2000

Paper No: IMECE2000-1423

DOI: https://doi.org/10.1115/IMECE2000-1423

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Topics: Aluminum, Contact resistance, Vacuum, Temperature, Pressure, Surface roughness, Cladding systems (Building), Cooling, Design, Electrical conductance

2 3 4

NARROW

Development of a High Flux Conduction Calibration Apparatus

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 1 — Study of Contact Area

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 2 — Study of Thermal Contact Resistance

Contact Resistance Modeling and Measurements of an Electrostatically Actuated Micromechanical Switch

Validation of Methodologies for the Estimation of Blood Perfusion Using a Minimally Invasive Probe

Detachable Fine Bump Connection Using Multi-Walled Carbon-Nanotube Bundles for 3D Semiconductor Modules

Laser Opto Microactuators Rotated by Molecular Gas Dynamics Effects

Thermal Conductivity Measurement of CVD Diamond Films Using a Modified Thermal Comparator Method

Three-Dimensional Thermal Model of Resistance Spot Welding in Aluminum

Estimating the Maximum Splat Diameter of a Solidifying Droplet

An Apparatus for Measuring the Effective Thermal Conductivity of the Body Surface

The Feasibility of Using Photothermal Deflection Spectroscopy to Measure Thermal Contact Resistance in a Film on Substrate System

Damage Assessment in Thermal Barrier Coatings Using Thermal Wave Imaging Technique

Thermal Modeling of a Liquid-Cooled Electric Machine

A Micro/Macro Integrated Model for Melt Flow and Non-Equilibrium Solidification for Thermal Spraying

Prediction of Thermal Contact Conductance by Surface Deformation Analysis

Effect of Particle Volume Fraction on the Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material

Thermal Contact Resistance of Phase Change and Grease Type Polymeric Materials

Freezing of Molten Solder Droplets Impacting Onto Flat Substrates in Microgravity

Experimental Investigation of Contact Resistance Across Pressed Lead and Aluminum Contact in Vacuum

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