An electrothermal model of polysilicon thermal actuators has been developed. The electrothermal model requires knowledge of key material parameters, such as polysilicon resistivity, which vary based on the fabrication process. Empirical measurements and a TSUPREM model of the Multi-Users MEMS Processes (MUMPs) were used to analyze the polysilicon resistance characteristics. The electrothermal model was implemented in SPICE. The use of an electrical circuit simulator allowed simultaneous analysis of integrated MEMS and microelectronic systems. The SPICE model was successfully applied to a lateral thermal actuator and a thermal piston micromirror fabricated in MUMPs. The model results show excellent agreement with measured data.

This content is only available via PDF.
You do not currently have access to this content.