As the eager demand for high power-handling capability in smaller packages, thermally enhanced BGA (TEBGA) packages provide a very attractive solution in improving the poor thermal performance problems of conventional over molded plastic BGA packages. In this study, with solder joint reliability in concern during the initial package design stage, an engineering empirical approach using a finite-volume-weighted averaging technique is applied for characterizing the strain concentration field around the corners of solder joints due to a dramatic geometry/material change. Furthermore, a parametric finite element analysis is performed over number of geometry/material design parameters to investigate the dependence on the fatigue lives of the thermally loaded solder joint in a typical TEBGA assembly. Through the parametric design together with a rational characterization of the fatigue lives of the solder joints, the reliability characteristics of the thermally enhanced BGA package can then be effectively identified.

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