On the Difference of Subsurface Deformation Obtained by Image Correlation Technique From That of Plane Strain Deformation in Orthogonal Metal Cutting

Subsurface deformation in orthogonal metal cutting process is nowadays widely determined by image correlation techniques. To get clearer images of the cutting process, two methods were usually adopted to reduce workpiece material side flow in the literature. One is inducing a weak inclination angle of the cutting tool; the other is to restrict material side flow by a piece of thick glass. However, the differences between the subsurface deformation determined by observing the side surfaces in these two methods and that of plane strain deformation has not been studied yet. Therefore, this paper aims to study the differences of subsurface deformation obtained by these two methods quantitatively through numerical methods. It is found that the restrict side flow method surpasses the inducing an inclination angle method; inducing an inclination angle method will produce larger discrepancy than the side surface of typical orthogonal cutting which stands for observing the side surface directly. Besides, restrict material side flow method surpasses inducing an inclination angle method in the aspect of strain distribution across the width direction. To reduce the differences further, a new method called split-workpiece method based on the bonded-interface technique is proposed in this paper. To validate the effectiveness of this method, numerical comparisons between the subsurface deformation produced by the proposed method and that of the plane strain deformation are made. The results show that the subsurface deformation produced by the proposed method is much closer to that of plane strain deformation than the previous two methods.