Thermal management plays an important role in both high power electronics and energy conversion systems. A key issue in thermal management is the dissipation of the high heat flux generated by functional components. In this paper, various microstructures, nanostructures and hybrid micro/nano-structures were successfully fabricated on copper (Cu) surfaces, and the corresponding pool boiling heat transfer performance was systematically studied. It is found that the critical heat flux (CHF) of hybrid structured surfaces is about 15% higher than that of the surfaces with nanowires only and micro-pillars only. More importantly, the superheat at CHF for the hybrid structured surface is much smaller than that of the micro-pillared surface (about 35%), and a maximum heat transfer coefficient (HTC) of about 90,000W/m2K is obtained. Compared with the known best pool boiling performance on biporous media, a much larger HTC and much lower superheat at a heat flux of 250W/cm2 have been obtained on the novel hybrid-structured surfaces.
Enhanced Pool Boiling Performance on Micro-, Nano-, and Hybrid-Structured Surfaces
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Li, Q, Wang, W, Oshman, C, Latour, B, Li, C, Bright, VM, Lee, Y, & Yang, R. "Enhanced Pool Boiling Performance on Micro-, Nano-, and Hybrid-Structured Surfaces." Proceedings of the ASME 2011 International Mechanical Engineering Congress and Exposition. Volume 10: Heat and Mass Transport Processes, Parts A and B. Denver, Colorado, USA. November 11–17, 2011. pp. 633-640. ASME. https://doi.org/10.1115/IMECE2011-64921
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