The effects of rarefaction on convective heat transfer and pressure drop characteristics are numerically evaluated for uniform wall heat flux rectangular microchannels. Results are obtained by numerically solving the momentum and energy equations with both first- and second-order slip velocity and temperature jump boundary conditions. The resulting velocity and temperature fields are then evaluated to obtain the microchannel Poiseuille and Nusselt numbers. In addition to the effects of rarefaction, the effects of aspect ratio, thermal creep flow, and viscous dissipation are investigated for locally fully developed Poiseuille and Nusselt numbers. The constant wall heat flux results obtained in this study are compared to constant wall temperature results obtained previously, using the same numerical algorithm, at various aspect ratios including the limiting case of parallel plate microchannels. In addition to supplying previously unreported data on slip flow convective heat transfer and pressure drop characteristics, these results verify the numerical algorithm for more complex future slip flow analyses.
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ASME 2007 International Mechanical Engineering Congress and Exposition
November 11–15, 2007
Seattle, Washington, USA
Conference Sponsors:
- ASME
ISBN:
0-7918-4305-X
PROCEEDINGS PAPER
Effects of Creep Flow and Viscous Dissipation in the Slip Regime for Isoflux Rectangular Microchannels
Jennifer van Rij,
Jennifer van Rij
University of Utah, Salt Lake City, UT
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Tim Ameel,
Tim Ameel
University of Utah, Salt Lake City, UT
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Todd Harman
Todd Harman
University of Utah, Salt Lake City, UT
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Jennifer van Rij
University of Utah, Salt Lake City, UT
Tim Ameel
University of Utah, Salt Lake City, UT
Todd Harman
University of Utah, Salt Lake City, UT
Paper No:
IMECE2007-42619, pp. 971-978; 8 pages
Published Online:
May 22, 2009
Citation
van Rij, J, Ameel, T, & Harman, T. "Effects of Creep Flow and Viscous Dissipation in the Slip Regime for Isoflux Rectangular Microchannels." Proceedings of the ASME 2007 International Mechanical Engineering Congress and Exposition. Volume 11: Micro and Nano Systems, Parts A and B. Seattle, Washington, USA. November 11–15, 2007. pp. 971-978. ASME. https://doi.org/10.1115/IMECE2007-42619
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