In the present study, a numerical approach for characterizing three-dimensional (3-D) electronic packages is presented, based on the steady-state solution of the thermal network method for generalized rectangular geometries, where boundary conditions are uniformly specified over specific regions of the package. As we know, the thermal-network method is very powerful on thermal analysis of electronic packaging because of its feasibility and flexibility. Accordingly, the numerical approach with thermal-network method to simulate heat transfer characteristics for 3-D package geometries becomes important in the modem microelectronic applications. The thermal analyses are presented with a general overview of the thermal network method, boundary conditions and solution procedures. Furthermore, the application of boundary conditions at the fluid-solid, package-board and layer-layer interfaces provides a means for obtaining a unique numerical result for 3-D complex electronic packages. The complex geometries found in most 3-D electronic package configurations are modeled using numerical method through the careful use of simplifying assumptions. Comparisons of the present numerical results with the existing experimental data for 3-D electronic package of pin grid arrays and multi-chip modules are made with a satisfactory agreement. Thus, the present study demonstrates that the numerical thermal-network approach can offer an accurate and efficient solution procedure for evaluating the thermal characterization of 3-D electronic packages.
A Thermal Network Approach for Predicting Thermal Characteristics of Three-Dimensional Electronic Packages
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Chen, PL, Chang, SF, Wu, TY, & Hung, YH. "A Thermal Network Approach for Predicting Thermal Characteristics of Three-Dimensional Electronic Packages." Proceedings of the ASME 2006 International Mechanical Engineering Congress and Exposition. Heat Transfer, Volume 3. Chicago, Illinois, USA. November 5–10, 2006. pp. 113-120. ASME. https://doi.org/10.1115/IMECE2006-13755
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