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Proceedings Papers

Experimental Study of Flow Boiling Heat Transfer Coefficient of FC-72 Over Micro-Pin-Finned Surfaces

Y. F. Xue, M. Z. Yuan, J. J. Wei

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 221-228, August 8–13, 2010

Paper No: IHTC14-22282

DOI: https://doi.org/10.1115/IHTC14-22282

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Topics: Boiling, Flow (Dynamics), Heat transfer coefficients, Heat transfer, Fluids, Nucleate boiling, Forced convection, Heat flux, Computer cooling, Cooling

Proceedings Papers

Simulation of Fluid Flow and Heat Transfer of Flat Plate Heat Sinks With Spiral Inserts

Ganesh Subbuswamy, Xianchang Li

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 611-618, August 8–13, 2010

Paper No: IHTC14-22898

DOI: https://doi.org/10.1115/IHTC14-22898

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Topics: Flat plates, Fluid dynamics, Heat sinks, Heat transfer, Simulation, Flow (Dynamics), Pressure, Computer cooling, Computer simulation, Pressure drop

Proceedings Papers

Modeling Size Effects of a Portable Two-Phase Electronics Cooling Loop With Different Refrigerants

Tom Saenen, Martine Baelmans

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 535-545, August 8–13, 2010

Paper No: IHTC14-22770

DOI: https://doi.org/10.1115/IHTC14-22770

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Topics: Computer cooling, Modeling, Refrigerants, Microchannels, Secondary cells, Algorithms, Coolants, Cooling systems, Dynamic systems, Finite volume methods

Proceedings Papers

Active Flow Instability Control for Transient Two-Phase Electronics Cooling

Tie Jun Zhang, Yoav Peles, John T. Wen, Michael K. Jensen

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 637-648, August 8–13, 2010

Paper No: IHTC14-22919

DOI: https://doi.org/10.1115/IHTC14-22919

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Topics: Computer cooling, Flow instability, Transients (Dynamics), Boiling, Flow (Dynamics), Critical heat flux, Cooling, Heat, Oscillations, Refrigeration

Proceedings Papers

Analysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling

Hemin Hu, Jiahui Zhang, Xiaoze Du, Lijun Yang

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 449-458, August 8–13, 2010

Paper No: IHTC14-22181

DOI: https://doi.org/10.1115/IHTC14-22181

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Topics: Computational fluid dynamics, Computer cooling, Heat sinks

Proceedings Papers

The Application of Entransy Dissipation Theory in the Volume-to-Point Heat Conduction Problem

Liang Ge, Mingtian Xu, Lin Cheng

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 299-304, August 8–13, 2010

Paper No: IHTC14-22271

DOI: https://doi.org/10.1115/IHTC14-22271

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Topics: Energy dissipation, Heat conduction, Heat, Electrical conductivity, Thermal conductivity, Computer cooling, Cooling, Finite element methods, Integrated circuits, Operating temperature

Proceedings Papers

Start Up and Transient Response to Power Input of a Capillary Assisted Thermosyphon for Shipboard Electronics Cooling

V. Tudor, M. Cerza

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 575-583, August 8–13, 2010

Paper No: IHTC14-22843

DOI: https://doi.org/10.1115/IHTC14-22843

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Topics: Computer cooling, Transients (Dynamics), Heat, Cooling, Flat plates, Temperature, Electronics, Flow (Dynamics), Ships, Steady state

Proceedings Papers

An Experimental Study on the Effect of Configuration of Multiple Microchannels on Heat Removal for Electronic Cooling

Jingru Zhang, Shaurya Prakash, Yogesh Jaluria, Lei Lin

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 473-480, August 8–13, 2010

Paper No: IHTC14-22234

DOI: https://doi.org/10.1115/IHTC14-22234

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Topics: Computer cooling, Heat, Microchannels, Heat sinks, Heat transfer, Manufacturing, Anisotropy, Bonding, Chemical etching, Computer software

Proceedings Papers

An Experimental Study of Two Phase Multiple Jet Cooling on Straight-Finned Surfaces Using a Dielectric Fluid

Liang-Han Chien, Chin-Yao Chang, Han-Yang Liu

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 629-638, August 8–13, 2010

Paper No: IHTC14-22720

DOI: https://doi.org/10.1115/IHTC14-22720

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Topics: Cooling, Fluids, Flow (Dynamics), Jets, Computer cooling, Cooling systems, Electronics, Heat, Heat transfer, Nozzles

Proceedings Papers

An Experimental Study of Heat Pipe Performance Using Binary Mixture Fluids That Exhibit Strong Concentration Marangoni Effects

Kenneth M. Armijo, Van P. Carey

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 459-467, August 8–13, 2010

Paper No: IHTC14-23255

DOI: https://doi.org/10.1115/IHTC14-23255

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Topics: Fluids, Heat pipes, Water, Ethanol, Heat, Coolants, Heat flux, Heat transfer coefficients, Computer cooling, Condensers (steam plant)

Proceedings Papers

Effect of Working Fluid on Pulsating Heat Pipe Thermal Performance

Koji Fumoto, Masahiro Kawaji, Tsuyoshi Kawanami

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 393-399, August 8–13, 2010

Paper No: IHTC14-22714

DOI: https://doi.org/10.1115/IHTC14-22714

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Topics: Fluids, Heat pipes, Heat, Heat transfer, Surface tension, Aluminum tube, Boiling, Boundary-value problems, Computer cooling, Condensation

Proceedings Papers

Effects of Thermal Boundary Conditions on Entropy Generation During Natural Convection in a Differentially Heated Square Cavity

Ram Satish Kaluri, Tanmay Basak, A. R. Balakrishnan

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 7, 147-156, August 8–13, 2010

Paper No: IHTC14-23112

DOI: https://doi.org/10.1115/IHTC14-23112

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Topics: Boundary-value problems, Cavities, Entropy, Natural convection, Heat transfer, Heating, Viscosity, Computer cooling, Design, Energy storage

Proceedings Papers

Dropwise Condensation Life Testing of Self Assembled Monolayers

Richard W. Bonner, III

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 2, 221-226, August 8–13, 2010

Paper No: IHTC14-22936

DOI: https://doi.org/10.1115/IHTC14-22936

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Topics: Condensation, Life testing, Self-assembly, Coatings, Electronics, Heat pipes, Computer cooling, Copper, Electronic packages, Flux (Metallurgy)

Proceedings Papers

Fluid Flow and Boiling Heat Transfer in Mini Channels

M. Venkatesan, M. Aravinthan, Sarit K. Das, A. R. Balakrishnan

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 203-210, August 8–13, 2010

Paper No: IHTC14-23095

DOI: https://doi.org/10.1115/IHTC14-23095

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Topics: Boiling, Fluid dynamics, Heat transfer, Flow (Dynamics), Two-phase flow, Computer cooling, Dimensions, Fluids, Friction, Heat exchangers

Proceedings Papers

Conjugate Heat Transfer Within a Heterogeneous Hierarchical Structure

Ivan Catton

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 8, 753-773, August 8–13, 2010

Paper No: IHTC14-23421

DOI: https://doi.org/10.1115/IHTC14-23421

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Topics: Heat transfer, Porous materials, Heat, Heat exchangers, Temperature, Design, Modeling, Optimization, Turbulence, Computational fluid dynamics

NARROW

Experimental Study of Flow Boiling Heat Transfer Coefficient of FC-72 Over Micro-Pin-Finned Surfaces

Simulation of Fluid Flow and Heat Transfer of Flat Plate Heat Sinks With Spiral Inserts

Modeling Size Effects of a Portable Two-Phase Electronics Cooling Loop With Different Refrigerants

Active Flow Instability Control for Transient Two-Phase Electronics Cooling

Analysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling

The Application of Entransy Dissipation Theory in the Volume-to-Point Heat Conduction Problem

Start Up and Transient Response to Power Input of a Capillary Assisted Thermosyphon for Shipboard Electronics Cooling

An Experimental Study on the Effect of Configuration of Multiple Microchannels on Heat Removal for Electronic Cooling

An Experimental Study of Two Phase Multiple Jet Cooling on Straight-Finned Surfaces Using a Dielectric Fluid

An Experimental Study of Heat Pipe Performance Using Binary Mixture Fluids That Exhibit Strong Concentration Marangoni Effects

Effect of Working Fluid on Pulsating Heat Pipe Thermal Performance

Effects of Thermal Boundary Conditions on Entropy Generation During Natural Convection in a Differentially Heated Square Cavity

Dropwise Condensation Life Testing of Self Assembled Monolayers

Fluid Flow and Boiling Heat Transfer in Mini Channels

Conjugate Heat Transfer Within a Heterogeneous Hierarchical Structure

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