Forced flow of refrigerants and dielectric liquids, undergoing phase change in a heated microgap channel between chips or in parallel microchannels in a compact cooler, is a promising candidate for the thermal management of advanced semiconductor devices. It has been found that Annular flow is the dominant flow regime in such miniature channels and that relatively high heat transfer coefficients are encountered in the moderate-to-high quality sections of such channels. Following a discussion of flow regimes and thermal characteristics of miniature channels, attention turns to exploring the parametric dependence of annular flow thermal transport in microgaps including the effects of channel diameter, mass flux, and working fluid on the two-phase heat transfer coefficients.

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