1-4 of 4
Electronic packages
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Thermal Analysis of Air-Cooled Electronic Equipment

Y. I. Sharaf-Eldeen, Kannan Rengarajan
Proc. ASME. CIE92, ASME 1992 International Computers in Engineering Conference: Volume 1 — Artificial Intelligence; Expert Systems; CAD/CAM/CAE; Computers in Fluid Mechanics/Thermal Systems, 517-526, August 2–6, 1992
Paper No: CIE1992-0061
DOI: https://doi.org/10.1115/CIE1992-0061
View Paper
PDF
Topics: Air flow, Computer simulation, Cooling, Electronic components, Electronic equipment, Electronic packages, Emissivity, Geometry, Heat, Heat transfer
Proceedings Papers

A Survey of Electronic Package Manufacturing Analysis Methods Suitable for Integration With Multidisciplinary Optimization

Jacob Korngold, Gary A. Gabriele
Proc. ASME. DETC94, 20th Design Automation Conference: Volume 2 — Robust Design Applications; Decomposition and Design Optimization; Optimization Tools and Applications, 205-212, September 11–14, 1994
Paper No: DETC1994-0129
DOI: https://doi.org/10.1115/DETC1994-0129
View Paper
PDF
Topics: Electronic packages, Manufacturing, Optimization, Design, Engineering disciplines, Concurrent engineering, Electronic packaging, Printed circuit boards, Sheet metal
Proceedings Papers

Material Parameter Identification of Viscoplastic Model for Solder Alloy in Electronics Package Using Bayesian Calibration

Jinhyuk Gang, Jooho Choi, Bonghee Lee, Jinwon Joo
Proc. ASME. IDETC-CIE2010, Volume 3: 30th Computers and Information in Engineering Conference, Parts A and B, 827-834, August 15–18, 2010
Paper No: DETC2010-28603
DOI: https://doi.org/10.1115/DETC2010-28603
View Paper
PDF
Topics: Alloys, Calibration, Chain, Electronic packages, Solders
Proceedings Papers

Reliability of the Flexible Display STN LCD Based Environmental Test

Pan-Dong Fan, Qiang Miao, Ping Yang, Quayle Chen, Tom Xue, Leon Xu, Antti Salo
Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 725-729, August 30–September 2, 2009
Paper No: DETC2009-87097
DOI: https://doi.org/10.1115/DETC2009-87097
View Paper
PDF
Topics: Reliability, Heat, Failure, Failure mechanisms, Brightness (Photometry), Electronic packages, Inspection, Polymers, Temperature