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Proceedings Papers

Applications of Electrical Impedance Tomography to Nondestructive Evaluation

Fadil Santosa
Proc. ASME. DETC95, Volume 3C: 15th Biennial Conference on Mechanical Vibration and Noise — Vibration Control, Analysis, and Identification, 931-937, September 17–20, 1995
Paper No: DETC1995-0661
DOI: https://doi.org/10.1115/DETC1995-0661
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Topics: Impedance (Electricity), Nondestructive evaluation, Imaging, Biomedical imaging, Corrosion, Electrical conductivity, Fracture (Materials), Plates (structures), Thermal conductivity
Proceedings Papers

An Operator-Adjoint Approach to Electrical Impedance Tomography

J. G. Wade
Proc. ASME. DETC95, Volume 3C: 15th Biennial Conference on Mechanical Vibration and Noise — Vibration Control, Analysis, and Identification, 947-954, September 17–20, 1995
Paper No: DETC1995-0663
DOI: https://doi.org/10.1115/DETC1995-0663
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Topics: Impedance (Electricity), Electrical conductivity, Extended irreversible thermodynamics, Degrees of freedom, Electric current, Imaging, Inverse problems
Proceedings Papers

Elastic Impedance Tomography

Gen Nakamura, Gunther Uhlmann
Proc. ASME. DETC95, Volume 3C: 15th Biennial Conference on Mechanical Vibration and Noise — Vibration Control, Analysis, and Identification, 987-992, September 17–20, 1995
Paper No: DETC1995-0668
DOI: https://doi.org/10.1115/DETC1995-0668
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Topics: Electrical conductivity, Inverse problems, Nondestructive evaluation, Scattering theory, Tensors
Proceedings Papers

Designing for Material Separation: Lessons From Automotive Recycling

Stewart Coulter, Bert Bras, Gerald Winslow, Susan Yester
Proc. ASME. DETC-CIE96, Volume 1: Design for Manufacturing Conference, V001T01A006, August 18–22, 1996
Paper No: 96-DETC/DFM-1270
DOI: https://doi.org/10.1115/96-DETC/DFM-1270
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Topics: Design, Design for Manufacturing, Recycling, Separation (Technology), Vehicles, Automobiles, Density, Electrical conductivity, Engineers, Instrumentation
Proceedings Papers

Computational Methods for Nonsmooth Acoustic Systems Arising in an Electromagnetic Hysteresis Identification Problem

H. T. Banks, J. K. Raye
Proc. ASME. IDETC-CIE2001, Volume 6B: 18th Biennial Conference on Mechanical Vibration and Noise, 1399-1407, September 9–12, 2001
Paper No: DETC2001/VIB-21467
DOI: https://doi.org/10.1115/DETC2001/VIB-21467
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Topics: Acoustics, Computational methods, Waves, Polarization (Electricity), Polarization (Light), Polarization (Waves), Algebra, Approximation, Biological tissues, Diffraction gratings
Proceedings Papers

Fabrication of PLA/CNT Composite Scaffolds by Fused Deposition Modeling

Lara Rebaioli, Claudia Pagano, Irene Fassi
Proc. ASME. IDETC-CIE2018, Volume 4: 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems, V004T08A032, August 26–29, 2018
Paper No: DETC2018-86097
DOI: https://doi.org/10.1115/DETC2018-86097
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Topics: Carbon nanotubes, Composite materials, Manufacturing, Modeling, Bone, Adhesion, Biodegradation, Biological tissues, Damage, Electrical conductivity
Proceedings Papers

Multiphysics Modeling and Experimental Validation of Reconfigurable, E-Textile Origami Antennas

Hamil Shah, Abdullahi Inshaar, Chengzhe Zou, Shreyas Chaudhari, Saad Alharbi, Asimina Kiourti, Ryan L. Harne
Proc. ASME. IDETC-CIE2018, Volume 5B: 42nd Mechanisms and Robotics Conference, V05BT07A057, August 26–29, 2018
Paper No: DETC2018-85603
DOI: https://doi.org/10.1115/DETC2018-85603
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Topics: Modeling, Textiles, Deformation, Shapes, Architecture, Dipoles (Electromagnetism), Electrical conductivity, Mechanical structures, Radiation (Physics), Waves
Proceedings Papers

PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices

Yoav Sterman, Erik D. Demaine, Neri Oxman
Proc. ASME. IDETC-CIE2013, Volume 6B: 37th Mechanisms and Robotics Conference, V06BT07A029, August 4–7, 2013
Paper No: DETC2013-12497
DOI: https://doi.org/10.1115/DETC2013-12497
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Topics: Computation, Computer-aided engineering, Design, Electrical conductivity, Electronics, Engineering prototypes, Light-emitting diodes, Manufacturing, Materials properties, Printed circuit boards
Proceedings Papers

High Resolution Microscopy of SiO 2 and the Structure of SiO 2 -Supported Graphene

Kristen M. Burson, Mahito Yamamoto, William G. Cullen
Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 551-555, August 28–31, 2011
Paper No: DETC2011-48737
DOI: https://doi.org/10.1115/DETC2011-48737
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Topics: Graphene, Microscopy, Resolution (Optics), Atomic force microscopy, Surface roughness, Adhesion, Energetics, Chemical properties, Density, Elasticity
Proceedings Papers

Microgrooves Enhanced AC Electrothermal Pumping for High Conductivity Microfluids

E. Du, Souran Manoochehri
Proc. ASME. IDETC-CIE2008, Volume 4: 20th International Conference on Design Theory and Methodology; Second International Conference on Micro- and Nanosystems, 831-837, August 3–6, 2008
Paper No: DETC2008-49492
DOI: https://doi.org/10.1115/DETC2008-49492
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Topics: Electrical conductivity, Thermal conductivity, Computer simulation, Fluids, Temperature, Theoretical analysis
Proceedings Papers

Joule Heating Induced Heat Transfer and Its Effects on Electrokinetic Mixing in T-Shape Microfluidic Channels

Gongyue Tang, Chun Yang, Yee Cheong Lam
Proc. ASME. IDETC-CIE2007, Volume 3: 19th International Conference on Design Theory and Methodology; 1st International Conference on Micro- and Nanosystems; and 9th International Conference on Advanced Vehicle Tire Technologies, Parts A and B, 643-651, September 4–7, 2007
Paper No: DETC2007-35136
DOI: https://doi.org/10.1115/DETC2007-35136
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Topics: Electrokinetics, Heat transfer, Heating, Joules, Microfluidics, Shapes, Plasma desorption mass spectrometry, Computer simulation, Electric fields, Flow (Dynamics)
Proceedings Papers

Capillary Flows of Highly Filled Epoxy/Ni Suspensions for Conductive Adhesive Applications

Jianguo Zhou, Erol Sancaktar
Proc. ASME. IDETC-CIE2007, Volume 4: ASME/IEEE International Conference on Mechatronic and Embedded Systems and Applications and the 19th Reliability, Stress Analysis, and Failure Prevention Conference, 505-512, September 4–7, 2007
Paper No: DETC2007-34401
DOI: https://doi.org/10.1115/DETC2007-34401
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Topics: Adhesives, Epoxy adhesives, Epoxy resins, Flow (Dynamics), Electrical conductivity, Binders (Materials), Extruding, Filtration, Flow instability, Resins
Proceedings Papers

The Effect of Form on Attributing Meanings to Materials

Elvin Karana, Wikke van Weelderen, Ernst-Jan van Woerden
Proc. ASME. IDETC-CIE2007, Volume 2: 27th Computers and Information in Engineering Conference, Parts A and B, 471-487, September 4–7, 2007
Paper No: DETC2007-34646
DOI: https://doi.org/10.1115/DETC2007-34646
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Topics: Design, Elasticity, Electrical conductivity, Product design, Thermal conductivity
Proceedings Papers

The Effects of Filler Volume Fraction and Film Thickness on Resistivity of Conductive Adhesives

Erol Sancaktar, Lan Bai
Proc. ASME. IDETC-CIE2003, Volume 3c: 17th Reliability, Stress Analysis and Failure Prevention Conference, 957-974, September 2–6, 2003
Paper No: DETC2003/RSAFP-48694
DOI: https://doi.org/10.1115/DETC2003/RSAFP-48694
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Topics: Adhesives, Electrical resistivity, Fillers (Materials), Film thickness, Shapes, Electrical conductivity, Epoxy adhesives, Epoxy resins, Particulate matter, Thermal conductivity