In this study, a method of computer model calibration is applied to quantify the uncertainties arising in the material characterization of the solder joint in the microelectronics package subject to a thermal cycle. In this study, all uncertainties are addressed by using a Bayesian calibration approach. A special specimen that characterizes the solder property due to the shear deformation is prepared, from which the Moire´ fringe is measured by running a thermal cycle. Viscoplastic finite element analysis procedure is constructed for the specimen based on the Anand model. Gaussian process model known as Kriging is employed to approximate the original finite element analysis (FEA) model. Posterior distribution for the unknown Anand parameters is formulated from the likelihood function for joint full-field displacements of computation and experiment. Markov Chain Monte Carlo (MCMC) method is employed to simulate posterior distribution. As a result, the displacements are predicted in the form of confidence interval. The results show that the proposed approach can be a useful tool in the estimation of the unknown material parameters in a probabilistic manner by effectively accounting for the uncertainties due to the experimental and computational models.
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ASME 2010 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 15–18, 2010
Montreal, Quebec, Canada
Conference Sponsors:
- Design Engineering Division and Computers in Engineering Division
ISBN:
978-0-7918-4411-3
PROCEEDINGS PAPER
Material Parameter Identification of Viscoplastic Model for Solder Alloy in Electronics Package Using Bayesian Calibration
Jinhyuk Gang,
Jinhyuk Gang
Korea Aerospace University, Goyang, Gyeonggi, Korea
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Jooho Choi,
Jooho Choi
Korea Aerospace University, Goyang, Gyeonggi, Korea
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Bonghee Lee,
Bonghee Lee
Chungbuk National University, Cheongju, Chungbuk, Korea
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Jinwon Joo
Jinwon Joo
Chungbuk National University, Cheongju, Chungbuk, Korea
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Jinhyuk Gang
Korea Aerospace University, Goyang, Gyeonggi, Korea
Jooho Choi
Korea Aerospace University, Goyang, Gyeonggi, Korea
Bonghee Lee
Chungbuk National University, Cheongju, Chungbuk, Korea
Jinwon Joo
Chungbuk National University, Cheongju, Chungbuk, Korea
Paper No:
DETC2010-28603, pp. 827-834; 8 pages
Published Online:
March 8, 2011
Citation
Gang, J, Choi, J, Lee, B, & Joo, J. "Material Parameter Identification of Viscoplastic Model for Solder Alloy in Electronics Package Using Bayesian Calibration." Proceedings of the ASME 2010 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 3: 30th Computers and Information in Engineering Conference, Parts A and B. Montreal, Quebec, Canada. August 15–18, 2010. pp. 827-834. ASME. https://doi.org/10.1115/DETC2010-28603
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