This paper reports enhanced adhesion and friction of biologically inspired mushroom-shaped elastomer microfibers which are fabricated using micromolding and the notching effect during deep reactive ion etching (DRIE). The fabrication approach of this work allows mushroom-shaped small diameter fibers down to 100s of nanometer scale (using interference lithography) with high uniformity, and high yield in large area. The fabricated microfiber arrays demonstrate approximately up to 17 time higher adhesion and around twice higher static friction than the nonfibrillar flat elastomer surface on a 6 mm diameter glass hemisphere. Moreover, adhesion experiments with the microfiber arrays which have different thickness backing layers reveal the significance of the backing layer thickness on adhesion of the fiber arrays on smooth contact surfaces.
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ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 3–6, 2008
Brooklyn, New York, USA
Conference Sponsors:
- Design Engineering Division and Computers in Engineering Division
ISBN:
978-0-7918-4328-4
PROCEEDINGS PAPER
Fabrication and Characterization of Biologically Inspired Mushroom-Shaped Elastomer Microfiber Arrays
Seok Kim,
Seok Kim
Carnegie Mellon University, Pittsburgh, PA
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Metin Sitti
Metin Sitti
Carnegie Mellon University, Pittsburgh, PA
Search for other works by this author on:
Seok Kim
Carnegie Mellon University, Pittsburgh, PA
Metin Sitti
Carnegie Mellon University, Pittsburgh, PA
Paper No:
DETC2008-49825, pp. 839-847; 9 pages
Published Online:
July 13, 2009
Citation
Kim, S, & Sitti, M. "Fabrication and Characterization of Biologically Inspired Mushroom-Shaped Elastomer Microfiber Arrays." Proceedings of the ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 4: 20th International Conference on Design Theory and Methodology; Second International Conference on Micro- and Nanosystems. Brooklyn, New York, USA. August 3–6, 2008. pp. 839-847. ASME. https://doi.org/10.1115/DETC2008-49825
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