An improved theoretical approach is presented to calculate and predict the quality factors of flexible microcantilevers affected by squeeze-film damping at low ambient pressures, and moderate to high Knudsen numbers. Veijola’s model [1], originally derived for a rigid oscillating plate near a wall, is extended to a flexible cantilever beam and both the gas inertia effect and slip boundary condition are considered in deriving resulting damping pressure. The model is used to predict the natural frequencies and quality factors of silicon microcantilevers with small gaps and their dependence on ambient pressure. In contrast to non-slip, continuum models, we find that quality factor depends strongly on ambient pressure, and that the damping of higher modes is more sensitive to ambient pressure than the fundamental.
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ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 3–6, 2008
Brooklyn, New York, USA
Conference Sponsors:
- Design Engineering Division and Computers in Engineering Division
ISBN:
978-0-7918-4328-4
PROCEEDINGS PAPER
Squeeze-Film Damping of Flexible Microcantilevers at Low Ambient Pressures
Jin Woo Lee,
Jin Woo Lee
Purdue University, West Lafayette, IN
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Arvind Raman,
Arvind Raman
Purdue University, West Lafayette, IN
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Hartono Sumali
Hartono Sumali
Sandia National Laboratories, Albuquerque, NM
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Jin Woo Lee
Purdue University, West Lafayette, IN
Arvind Raman
Purdue University, West Lafayette, IN
Hartono Sumali
Sandia National Laboratories, Albuquerque, NM
Paper No:
DETC2008-49507, pp. 529-533; 5 pages
Published Online:
July 13, 2009
Citation
Lee, JW, Raman, A, & Sumali, H. "Squeeze-Film Damping of Flexible Microcantilevers at Low Ambient Pressures." Proceedings of the ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 4: 20th International Conference on Design Theory and Methodology; Second International Conference on Micro- and Nanosystems. Brooklyn, New York, USA. August 3–6, 2008. pp. 529-533. ASME. https://doi.org/10.1115/DETC2008-49507
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