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Proceedings Papers

Geometric Optimisation of Conjugate Pentagonal Cooling Channels With Internal Heat Generation

Olabode Thomas Olakoyejo, Lauber Martins, Surajudeen Olanrewaju Obayopo, Josua Petrus Meyer
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T05A009, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-22154
https://doi.org/10.1115/ICNMM2014-22154
View Paper titled, Geometric Optimisation of Conjugate Pentagonal Cooling Channels With Internal Heat Generation
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Topics: Cooling, Heat, Optimization, Pressure, Thermal resistance, Design, Fluids, Forced convection, Geometry, Optimization algorithms
Proceedings Papers

Integration of a Pulsating Heat Pipe in a Flat Plate Heat Sink

Mitchell P. Hoesing, Gregory J. Michna
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T05A001, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-21233
https://doi.org/10.1115/ICNMM2014-21233
View Paper titled, Integration of a Pulsating Heat Pipe in a Flat Plate Heat Sink
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Topics: Flat plates, Heat pipes, Heat sinks, Condensers (steam plant), Fluids, Thermal resistance, Water, Aluminum, Aluminum plate, Design
Proceedings Papers

Numerical Analysis and Thermal Testing of a Microchannel Chassis for Military Electronics Cooling Applications

Uğur Alakoç, Selçuk Öksüz, Tolga Ayyılmaz
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T05A010, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-22205
https://doi.org/10.1115/ICNMM2014-22205
View Paper titled, Numerical Analysis and Thermal Testing of a Microchannel Chassis for Military Electronics Cooling Applications
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Topics: Computer cooling, Microchannels, Military systems, Numerical analysis, Testing, Coolants, Temperature, Flow (Dynamics), Heat flux, Aluminum
Proceedings Papers

Single-Phase Cryogenic Flows Through Microchannel Heat Sinks

Erfan Rasouli, Vinod Narayanan
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T05A002, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-21275
https://doi.org/10.1115/ICNMM2014-21275
View Paper titled, Single-Phase Cryogenic Flows Through Microchannel Heat Sinks
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Topics: Flow (Dynamics), Heat sinks, Microchannels, Laminar flow, Reynolds number, Combustion chambers, Cooling, Fluids, Friction, Geometry
Proceedings Papers

Heat Sink With Stacked Multi-Layer Porous Media

Arun K. Karunanithi, Fatemeh Hassanipour
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T05A003, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-21370
https://doi.org/10.1115/ICNMM2014-21370
View Paper titled, Heat Sink With Stacked Multi-Layer Porous Media
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Topics: Heat sinks, Porous materials, Porosity, Pressure drop, Thermal resistance
Proceedings Papers

Thermal Characterization of Multiple Micro-Jet Impingement Cooling Model

Afzal Husain, Jun-Hee Kim, Kwang-Yong Kim
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T05A004, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-21736
https://doi.org/10.1115/ICNMM2014-21736
View Paper titled, Thermal Characterization of Multiple Micro-Jet Impingement Cooling Model
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Topics: Impingement cooling, Thermal characterization, Flow (Dynamics), Heat sinks, Laminar flow, Design, Silicon, Boundary-value problems, Cross-flow, Electronics
Proceedings Papers

Electrical Interconnect and Microfluidic Cooling Within 3D ICs and Silicon Interposer

Hanju Oh, Yue Zhang, Li Zheng, Muhannad S. Bakir
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T05A005, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-21813
https://doi.org/10.1115/ICNMM2014-21813
View Paper titled, Electrical Interconnect and Microfluidic Cooling Within 3D ICs and Silicon Interposer
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Topics: Cooling, Microfluidics, Silicon, Heat, Energy dissipation, Fins, Heat sinks, Integrated circuits, Power density, Solders
Proceedings Papers

Effect of Inclination Angle on Pulsating Heat Pipe Performance

Sagar Babu Paudel, Gregory J. Michna
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T05A006, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-22016
https://doi.org/10.1115/ICNMM2014-22016
View Paper titled, Effect of Inclination Angle on Pulsating Heat Pipe Performance
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Topics: Heat pipes, Flux (Metallurgy), Heat, Thermal resistance, Computer cooling, Construction, Copper, Heat transfer, Microelectronic devices, Pressure
Proceedings Papers

Design of a Mini Heat Sink Based on Constructal Theory for Electronic Chip Cooling

Srikanth Srinivasan, Shaikha Al-Suwaidi, Reza Sadr
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T05A007, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-22021
https://doi.org/10.1115/ICNMM2014-22021
View Paper titled, Design of a Mini Heat Sink Based on Constructal Theory for Electronic Chip Cooling
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Topics: Cooling, Design, Heat sinks, Flow (Dynamics), Fluids, Temperature distribution, Additive manufacturing, Computer engineering, Cooling systems, Dimensions
Proceedings Papers

Experimental Characterization of an Open Loop Pulsating Heat Pipe Cooler

Daniele Torresin, Mathieu Habert, Francesco Agostini, Bruno Agostini, Violette Mounier
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T05A008, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-22047
https://doi.org/10.1115/ICNMM2014-22047
View Paper titled, Experimental Characterization of an Open Loop Pulsating Heat Pipe Cooler
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Topics: Experimental characterization, Heat pipes, Cooling, Heat, Stress, Fluids, Computer cooling, Design, Fluid pressure, Maintenance
Proceedings Papers

Experimental Investigation on the Minichannel Cold Plate for High Temperature Uniformity Based on a Compact Thermal Model

Xiaobing Luo, Zhangming Mao
Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T05A001, June 16–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2013-73027
https://doi.org/10.1115/ICNMM2013-73027
View Paper titled, Experimental Investigation on the Minichannel Cold Plate for High Temperature Uniformity Based on a Compact Thermal Model
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Topics: High temperature, Heat, Fractals, Temperature, Microchannels, Temperature uniformity
Proceedings Papers

Measurement of Performance Characteristics of a Piezoelectric Micro Blower

Takashi Fukue, Koichi Hirose, Hirotoshi Terao
Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T05A002, June 16–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2013-73092
https://doi.org/10.1115/ICNMM2013-73092
View Paper titled, Measurement of Performance Characteristics of a Piezoelectric Micro Blower
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Topics: Air flow, Cooling, Density, Design, Diluents, Electricity (Physics), Electronic equipment, Fans, Flow (Dynamics), Forced convection
Proceedings Papers

Study of Supersonic Micro-Channel for Cooling Electronic Devices

Yuya Takahashi, Junnosuke Okajima, Yuka Iga, Atsuki Komiya, Wu-Shung Fu, Shigenao Maruyama
Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T05A003, June 16–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2013-73134
https://doi.org/10.1115/ICNMM2013-73134
View Paper titled, Study of Supersonic Micro-Channel for Cooling Electronic Devices
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Topics: Cooling, Microchannels, Nozzles, Heat transfer, Pressure, Shapes, Temperature, Gas flow, Geometry, Microscale devices
Proceedings Papers

Integrated Microfluidic Pumping for Cooling Applications

Arjan J. H. Frijns, Zhipeng Liu, Roy J. S. Derks, Michel F. M. Speetjens, Anton A. van Steenhoven
Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T05A004, June 16–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2013-73147
https://doi.org/10.1115/ICNMM2013-73147
View Paper titled, Integrated Microfluidic Pumping for Cooling Applications
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Topics: Cooling, Microfluidics, Temperature, Circuits, Electronics, Energy consumption, Flow (Dynamics), Heat, Integrated circuits, Light-emitting diodes
Proceedings Papers

Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis

Risako Kibushi, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T05A005, June 16–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2013-73169
https://doi.org/10.1115/ICNMM2013-73169
View Paper titled, Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis
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Topics: Heat, MOSFET transistors, Electrical properties, Electrons, Thermal energy, Crystal lattices, Electric fields, Electronics, Energy levels (Quantum mechanics), Temperature
Proceedings Papers

Thermal Performance of Oscillating Heat Pipes With Nanofluid: A Theoretical Study

Hamid Reza Seyf, Sejung Kim, Yuwen Zhang
Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T05A006, June 16–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2013-73178
https://doi.org/10.1115/ICNMM2013-73178
View Paper titled, Thermal Performance of Oscillating Heat Pipes With Nanofluid: A Theoretical Study
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Topics: Heat pipes, Nanofluids, Heat transfer, Particulate matter, Fluids, Nanoparticles, Water
Proceedings Papers

Numerical Modelling of Nanofluid Heat Transfer Inside a Microchannel Heat Sink

Benjamin Rimbault, Cong Tam Nguyen, Nicolas Galanis
Proc. ASME. ICNMM2012, ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels, 123-132, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2012-73004
https://doi.org/10.1115/ICNMM2012-73004
View Paper titled, Numerical Modelling of Nanofluid Heat Transfer Inside a Microchannel Heat Sink
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Topics: Heat sinks, Heat transfer, Microchannels, Modeling, Nanofluids, Water
Proceedings Papers

Fluid Flow and Heat Transfer Simulations of the Cooling-Water Channel in a Tera-Hertz Radiation Detector

Usama Tohid, Arturo Pacheco-Vega, Rodion Tikhoplav, Marcos Ruelas
Proc. ASME. ICNMM2012, ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels, 133-139, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2012-73272
https://doi.org/10.1115/ICNMM2012-73272
View Paper titled, Fluid Flow and Heat Transfer Simulations of the Cooling-Water Channel in a Tera-Hertz Radiation Detector
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Topics: Cooling, Engineering simulation, Fluid dynamics, Heat transfer, Radiation detectors, Simulation, Water, Temperature, Irradiation (Radiation exposure), Lasers
Proceedings Papers

Experimental Study on a Honeycomb Micro Channel Cooling System

Yonglu Liu, Xiaobing Luo, Wei Liu
Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 267-272, June 22–24, 2009
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2009-82059
https://doi.org/10.1115/ICNMM2009-82059
View Paper titled, Experimental Study on a Honeycomb Micro Channel Cooling System
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Topics: Cooling systems, Honeycomb structures, Microchannels, Cooling, Flow (Dynamics), Heat transfer, Pipes, Pumps, Fluids
Proceedings Papers

Enhanced Multi-Objective Optimization of a Microchannel Heat Sink Using Multiple Surrogates Modeling

Afzal Husain, Kwang-Yong Kim
Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 273-279, June 22–24, 2009
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2009-82120
https://doi.org/10.1115/ICNMM2009-82120
View Paper titled, Enhanced Multi-Objective Optimization of a Microchannel Heat Sink Using Multiple Surrogates Modeling
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Topics: Heat sinks, Microchannels, Modeling, Pareto optimization, Design, Algorithms, Approximation, Evolutionary algorithms, Experimental design, Feedback