The exponential growth in electronic power has brought amazing technology but with it also comes a burden in high heat production that threatens the safety of the product since electronics’ failure rate increases by its operating temperature. As such, cooling techniques have a key role to keep the temperature of electronics devices, such as processors, memory and graphics chips, below a maximum operating temperature. In this work, a porous filled heat exchanger has been numerically modeled to investigate the cooling effectiveness and temperature distribution on the base of the heat exchanger subjected to high heat flux leaving these devices. The effects of different nanofluid coolants (0.75% double walled carbon nanotube in water (DWCNT), 1% alumina in water, and 1% diamond in 20:80 ethylene glycol/water), porous materials (copper and annealed pyrolytic graphite (APG)), and porosity values are investigated. The coolant enters from an inlet channel normal to the base, moves through the porous field, and then leaves the heat exchanger through two opposite exit channels parallel to the base. The study is performed for two and three dimensional geometries in which two different designs are studied for 3D cases. One of the designs has a rectangular cross sectional inlet channel (along transverse direction) and the other design has square one. The results indicate that utilizing APG porous matrix, for all studied coolants of pure water and water based nano fluidics, improves substantially the cooling of the base of the heat exchanger in 2D and 3D with rectangular inlet. The results also show that utilizing carbon nanofluids (DWCNT) as coolant for high porosity structures, in both copper and APG porous matrices, improves cooling efficiency and temperature uniformity over the base, for all 2D and 3D cases. The effect of inlet channel geometry, square and rectangular, is also investigated for either similar velocity or similar mass flow rate at the inlet channel entrances.

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